30-8563 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 30POS GOLD
| Part | Current Rating | Termination Post Length | Material Flammability Rating | Features | Contact Finish Thickness - Mating | Termination | Pitch - Mating | Grid Rows | Number of Positions or Pins (Grid) | Grid Columns | Contact Finish - Post | Row Spacing | Type | Operating Temperature (Min) | Operating Temperature (Max) | Contact Material - Mating | Housing Material | Pitch - Post | Contact Finish Thickness - Post | Contact Material - Post | Mounting Type | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 3 A | 0.14 in | UL94 V-0 | Closed Frame Elevated | 30 µin | Solder | 0.1 in | 2 | 30 | 15 | Gold | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | -55 °C | 105 °C | Beryllium Copper | Glass Filled Nylon 4/6 PA46 Polyamide | 0.1 in | 10 µin | Brass | Through Hole | Gold |