FTMH-140 Series
Manufacturer: Samtec Inc.
CONN HEADER SMD 80POS 1MM
| Part | Number of Positions | Pitch - Mating | Insulation Color | Operating Temperature (Max) | Operating Temperature (Min) | Fastening Type | Contact Shape | Contact Finish - Mating | Contact Material | Current Rating (Per Contact) | Mounting Type | Row Spacing - Mating | Connector Type | Number of Rows | Termination | Contact Type | Number of Positions Loaded | Shrouding | Features | Contact Finish - Post | Contact Finish Thickness - Mating | Insulation Material | Insulation Height | Material Flammability Rating | Contact Length - Mating | Style | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 80 | 0.039 in | Black | 125 °C | -55 °C | Push-Pull | Square | Gold | Phosphor Bronze | 2.8 A | Surface Mount | 0.039 in | Header | 2 | Solder | Male Pin | All | Unshrouded | Pick and Place | Tin | 3 µin | Liquid Crystal Polymer (LCP) | 0.059 in | UL94 V-0 | 0.065 in | Board | |
Samtec Inc. | 80 | 0.039 in | Black | 125 °C | -55 °C | Push-Pull | Square | Gold | Phosphor Bronze | 2.8 A | Surface Mount | 0.039 in | Header | 2 | Solder | Male Pin | All | Unshrouded | Board Guide End Shrouds | Tin | 3 µin | Liquid Crystal Polymer (LCP) | 0.059 in | UL94 V-0 | 0.065 in | Board | |
Samtec Inc. | 80 | 0.039 in | Black | 125 °C | -55 °C | Push-Pull | Square | Gold | Phosphor Bronze | 2.8 A | Surface Mount | 0.039 in | Header | 2 | Solder | Male Pin | All | Unshrouded | Board Guide End Shrouds | Tin | 10 µin | Liquid Crystal Polymer (LCP) | 0.059 in | UL94 V-0 | 0.075 in | Board | |
Samtec Inc. | 80 | 0.039 in | Black | 125 °C | -55 °C | Push-Pull | Square | Gold | Phosphor Bronze | 2.8 A | Right Angle Surface Mount | 0.039 in | Header | 2 | Solder | Male Pin | All | Unshrouded | Tin | 3 µin | Liquid Crystal Polymer (LCP) | 0.125 in | UL94 V-0 | 0.065 in | Board | ||
Samtec Inc. | 80 | 0.039 in | Black | 125 °C | -55 °C | Push-Pull | Square | Gold | Phosphor Bronze | 2.8 A | Right Angle Surface Mount | 0.039 in | Header | 2 | Solder | Male Pin | All | Unshrouded | Pick and Place | Gold | 30 µin | Liquid Crystal Polymer (LCP) | 0.125 in | UL94 V-0 | 0.065 in | Board | 3 µin |
Samtec Inc. | 80 | 0.039 in | Black | 125 °C | -55 °C | Push-Pull | Square | Gold | Phosphor Bronze | 2.8 A | Surface Mount | 0.039 in | Header | 2 | Solder | Male Pin | All | Unshrouded | Tin | 10 µin | Liquid Crystal Polymer (LCP) | 0.059 in | UL94 V-0 | 0.075 in | Board | ||
Samtec Inc. | 80 | 0.039 in | Black | 125 °C | -55 °C | Push-Pull | Square | Gold | Phosphor Bronze | 2.8 A | Surface Mount | 0.039 in | Header | 2 | Solder | Male Pin | All | Unshrouded | End Shrouds Pick and Place | Tin | 10 µin | Liquid Crystal Polymer (LCP) | 0.059 in | UL94 V-0 | 0.075 in | Board | |
Samtec Inc. | 80 | 0.039 in | Black | 125 °C | -55 °C | Push-Pull | Square | Gold | Phosphor Bronze | 2.8 A | Right Angle Surface Mount | 0.039 in | Header | 2 | Solder | Male Pin | All | Unshrouded | Gold | 30 µin | Liquid Crystal Polymer (LCP) | 0.125 in | UL94 V-0 | 0.075 in | Board | 3 µin | |
Samtec Inc. | 80 | 0.039 in | Black | 125 °C | -55 °C | Push-Pull | Square | Gold | Phosphor Bronze | 2.8 A | Right Angle Surface Mount | 0.039 in | Header | 2 | Solder | Male Pin | All | Unshrouded | Tin | 10 µin | Liquid Crystal Polymer (LCP) | 0.125 in | UL94 V-0 | 0.065 in | Board | ||
Samtec Inc. | 80 | 0.039 in | Black | 125 °C | -55 °C | Push-Pull | Square | Gold | Phosphor Bronze | 2.8 A | Surface Mount | 0.039 in | Header | 2 | Solder | Male Pin | All | Unshrouded | End Shrouds | Tin | 3 µin | Liquid Crystal Polymer (LCP) | 0.059 in | UL94 V-0 | 0.065 in | Board |