211-1 Series

Catalog

CONN IC DIP SOCKET 6POS GOLD

Part	Termination	Housing Material	Pitch - Post	Pitch - Post	Material Flammability Rating	Operating Temperature [Max]	Operating Temperature [Min]	Features	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length	Termination Post Length	Contact Material - Mating	Mounting Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Contact Material - Post [custom]	Contact Finish - Mating	Contact Resistance	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
CnC Tech, LLC 211-1-06-003	Solder	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	UL94 V-0	105 ░C	-55 °C	Open Frame	Tin	10 çin	0.25 çm	0.11 in	2.78 mm	Beryllium Copper	Through Hole	2	6	3	0.3 "	7.62 mm	DIP	200 µin	5.08 µm	3 A	Brass	Gold	4 mOhm	0.1 in	2.54 mm
CnC Tech, LLC 211-1-20-003	Solder	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	UL94 V-0	105 ░C	-55 °C	Open Frame	Tin	10 çin	0.25 çm	0.11 in	2.78 mm	Beryllium Copper	Through Hole				0.3 "	7.62 mm	DIP	200 µin	5.08 µm	3 A	Brass	Gold	4 mOhm	0.1 in	2.54 mm	20
CnC Tech, LLC 211-1-32-006	Solder	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	UL94 V-0	105 ░C	-55 °C	Open Frame	Tin	10 çin	0.25 çm	0.11 in	2.78 mm	Beryllium Copper	Through Hole				0.6 in	15.24 mm	DIP	200 µin	5.08 µm	3 A	Brass	Gold	4 mOhm	0.1 in	2.54 mm		2 x 16	32
CnC Tech, LLC 211-1-18-003	Solder	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	UL94 V-0	105 ░C	-55 °C	Open Frame	Tin	10 çin	0.25 çm	0.11 in	2.78 mm	Beryllium Copper	Through Hole				0.3 "	7.62 mm	DIP	200 µin	5.08 µm	3 A	Brass	Gold	4 mOhm	0.1 in	2.54 mm	18
CnC Tech, LLC 211-1-08-003	Solder	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	UL94 V-0	105 ░C	-55 °C	Open Frame	Tin	10 çin	0.25 çm	0.11 in	2.78 mm	Beryllium Copper	Through Hole				0.3 "	7.62 mm	DIP	200 µin	5.08 µm	3 A	Brass	Gold	4 mOhm	0.1 in	2.54 mm	8
CnC Tech, LLC 211-1-14-003	Solder	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	UL94 V-0	105 ░C	-55 °C	Open Frame	Tin	10 çin	0.25 çm	0.11 in	2.78 mm	Beryllium Copper	Through Hole				0.3 "	7.62 mm	DIP	200 µin	5.08 µm	3 A	Brass	Gold	4 mOhm	0.1 in	2.54 mm	14
CnC Tech, LLC 211-1-40-006	Solder	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	UL94 V-0	105 ░C	-55 °C	Open Frame	Tin	10 çin	0.25 çm	0.11 in	2.78 mm	Beryllium Copper	Through Hole	2		20	0.6 in	15.24 mm	DIP	200 µin	5.08 µm	3 A	Brass	Gold	4 mOhm	0.1 in	2.54 mm	40