SOLDER PASTE NO CLEAN 500GM
| Part | Form | Form | Type | Shelf Life Start | Melting Point [custom] | Melting Point [custom] | Shelf Life | Process | Shipping Info | Storage/Refrigeration Temperature [Min] | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Min] | Mesh Type | Flux Type | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Kester Solder  | Jar  | 17.64 oz  500 g  | Solder Paste  | Date of Manufacture  | 361 °F  | 183 °C  | 4 Months  | Leaded  | Ships with Cold Pack. To ensure customer satisfaction and product integrity  air shipment is recommended.  | 0 °C  | 50 °F  | 10 °C  | 0 °C  | 3  | No-Clean  |