HEATSINK BGA W/ADHESIVE TAPE
| Part | Material | Length [x] | Length [x] | Material Finish | Width [x] | Width | Shape | Type | Thermal Resistance @ Forced Air Flow | Attachment Method | Power Dissipation @ Temperature Rise | Fin Height [z] | Fin Height [z] | Package Cooled | Thermal Resistance @ Natural |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Boyd Laconia, LLC 371824B00032G | Aluminum | 1.378 in | 35 mm | Black Anodized | 1.378 in | 35 mm | Pin Fins, Square | Top Mount | 9.7 °C/W, 200 LFM | Thermal Tape, Adhesive (Included) | 1.5 W | 7 mm | 0.275 in | BGA | 31.9 °C/W |