68-PGM1 Series

Catalog

CONN SOCKET PGA GOLD

Part	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Material Flammability Rating	Current Rating (Amps)	Contact Finish - Mating	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Contact Material - Mating	Type	Operating Temperature [Min]	Operating Temperature [Max]	Termination Post Length	Termination Post Length	Contact Finish - Post	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material
Aries Electronics 68-PGM10005-11H	Through Hole	10 çin	0.25 çm	UL94 V-0	3 A	Gold	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in	Beryllium Copper	PGA	-55 °C	125 °C	0.165 in	4.19 mm	Gold	Solder	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 68-PGM11033-10	Through Hole	200 µin	5.08 µm	UL94 V-0	3 A	Gold	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in	Beryllium Copper	PGA	-55 °C	105 ░C	0.165 in	4.19 mm	Tin	Solder	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 68-PGM11033-11	Through Hole	10 çin	0.25 çm	UL94 V-0	3 A	Gold	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in	Beryllium Copper	PGA	-55 °C	125 °C	0.165 in	4.19 mm	Gold	Solder	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 68-PGM10006-10	Through Hole	200 µin	5.08 µm	UL94 V-0	3 A	Gold	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in	Beryllium Copper	PGA			0.125 in	3.18 mm	Tin	Solder	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 68-PGM11033-10H	Through Hole	200 µin	5.08 µm	UL94 V-0	3 A	Gold	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in	Beryllium Copper	PGA	-55 °C	105 ░C	0.165 in	4.19 mm	Tin	Solder	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 68-PGM11032-10	Through Hole	200 µin	5.08 µm	UL94 V-0	3 A	Gold	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in	Beryllium Copper	PGA	-55 °C	105 ░C	0.165 in	4.19 mm	Tin	Solder	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)