CONN RCPT 60POS 0.05 GOLD SMD
| Part | Contact Type | Contact Finish - Post | Style | Number of Positions Loaded | Connector Type | Number of Rows | Mounting Type | Operating Temperature [Min] | Operating Temperature [Max] | Insulation Height | Insulation Height | Insulation Material | Fastening Type | Termination | Contact Material | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Contact Shape | Row Spacing - Mating | Row Spacing - Mating | Voltage Rating | Pitch - Mating | Pitch - Mating | Number of Positions | Insulation Color | Current Rating (Amps) | Contact Length - Post [x] | Contact Length - Post [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Female Socket | Tin | Board to Board Cable | All | Receptacle | 2 | Surface Mount | -55 °C | 125 °C | 4.57 mm | 0.18 " | Liquid Crystal Polymer (LCP) | Push-Pull | Solder | Phosphor Bronze | Pick and Place | 10 çin | 0.25 çm | Gold | Square | 0.05 in | 1.27 mm | 350 VAC | 0.05 in | 1.27 mm | 60 | Black | 3.1 A | ||
Samtec Inc. | Female Socket | Tin | Board to Board Cable | All | Receptacle | 2 | Surface Mount | -55 °C | 125 °C | 4.57 mm | 0.18 " | Liquid Crystal Polymer (LCP) | Push-Pull | Solder | Phosphor Bronze | Pick and Place | 3 µin | 0.076 µm | Gold | Square | 0.05 in | 1.27 mm | 350 VAC | 0.05 in | 1.27 mm | 60 | Black | 3.1 A | ||
Samtec Inc. | Female Socket | Tin | Board to Board Cable | All | Receptacle | 2 | Surface Mount | -55 °C | 125 °C | 4.57 mm | 0.18 " | Liquid Crystal Polymer (LCP) | Push-Pull | Solder | Phosphor Bronze | 10 çin | 0.25 çm | Gold | Square | 0.05 in | 1.27 mm | 350 VAC | 0.05 in | 1.27 mm | 60 | Black | 3.1 A | |||
Samtec Inc. | Female Socket | Tin | Board to Board Cable | All | Receptacle | 2 | Through Hole | -55 °C | 125 °C | 4.57 mm | 0.18 " | Liquid Crystal Polymer (LCP) | Push-Pull | Solder | Phosphor Bronze | 3 µin | 0.076 µm | Gold | Square | 0.05 in | 1.27 mm | 350 VAC | 0.05 in | 1.27 mm | 60 | Black | 3.1 A | 0.12 in | 3.05 mm | |
Samtec Inc. | Female Socket | Tin | Board to Board Cable | All | Receptacle | 2 | Through Hole | -55 °C | 125 °C | 4.57 mm | 0.18 " | Liquid Crystal Polymer (LCP) | Push-Pull | Solder | Phosphor Bronze | 10 çin | 0.25 çm | Gold | Square | 0.05 in | 1.27 mm | 350 VAC | 0.05 in | 1.27 mm | 60 | Black | 3.1 A | 0.12 in | 3.05 mm | |
Samtec Inc. | Female Socket | Tin | Board to Board Cable | All | Receptacle | 2 | Surface Mount | -55 °C | 125 °C | 4.57 mm | 0.18 " | Liquid Crystal Polymer (LCP) | Push-Pull | Solder | Phosphor Bronze | Pick and Place | 10 çin | 0.25 çm | Gold | Square | 0.05 in | 1.27 mm | 350 VAC | 0.05 in | 1.27 mm | 60 | Black | 3.1 A | ||
Samtec Inc. | Female Socket | Tin | Board to Board Cable | All | Receptacle | 2 | Surface Mount | -55 °C | 125 °C | 4.57 mm | 0.18 " | Liquid Crystal Polymer (LCP) | Push-Pull | Solder | Phosphor Bronze | Board Guide | 3 µin | 0.076 µm | Gold | Square | 0.05 in | 1.27 mm | 350 VAC | 0.05 in | 1.27 mm | 60 | Black | 3.1 A | ||
Samtec Inc. | Female Socket | Tin | Board to Board Cable | All | Receptacle | 2 | Through Hole | -55 °C | 125 °C | 4.57 mm | 0.18 " | Liquid Crystal Polymer (LCP) | Push-Pull | Solder | Phosphor Bronze | 3 µin | 0.076 µm | Gold | Square | 0.05 in | 1.27 mm | 350 VAC | 0.05 in | 1.27 mm | 60 | Black | 3.1 A | 0.12 in | 3.05 mm | |
Samtec Inc. | Female Socket | Tin | Board to Board Cable | All | Receptacle | 2 | Through Hole | -55 °C | 125 °C | 4.57 mm | 0.18 " | Liquid Crystal Polymer (LCP) | Push-Pull | Solder | Phosphor Bronze | Board Guide | 3 µin | 0.076 µm | Gold | Square | 0.05 in | 1.27 mm | 350 VAC | 0.05 in | 1.27 mm | 60 | Black | 3.1 A | 0.12 in | 3.05 mm |
Samtec Inc. | Female Socket | Tin | Board to Board Cable | All | Receptacle | 2 | Surface Mount | -55 °C | 125 °C | 4.57 mm | 0.18 " | Liquid Crystal Polymer (LCP) | Push-Pull | Solder | Phosphor Bronze | Pick and Place | 3 µin | 0.076 µm | Gold | Square | 0.05 in | 1.27 mm | 350 VAC | 0.05 in | 1.27 mm | 60 | Black | 3.1 A |