70-1608 Series
Manufacturer: Kester Solder
Beta
⌘K
SOLDER PASTE NO CLEAN 35GM
| Part | Shipping Info | Melting Point (Max) | Melting Point (Min) | Type | Ag Composition | Composition Elements | Composition Formula | Cu Composition | Sn Composition | Process | Mesh Type | Shelf Life | Storage/Refrigeration Temperature (Maximum) | Storage/Refrigeration Temperature (Minimum) | Shelf Life Start | Form Volume | Form | Form Weight |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Kester Solder | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | 424 °F | 423 °F | Solder Paste | 3 % | Ag Cu Sn | Sn96.5Ag3Cu0.5 | 0.5 % | 96.5 % | Lead Free | 3 | 6 Months | 50 °F | 32 °F | Date of Manufacture | 10 cc | Syringe | 1.23 oz |