Beta
⌘K
CONN SOCKET PGA ZIF GOLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post | Pitch - Mating | Pitch - Mating | Features | Termination | Material Flammability Rating | Termination Post Length | Termination Post Length | Contact Finish - Mating | Mounting Type | Contact Material - Mating | Type | Pitch - Post | Pitch - Post | Operating Temperature [Max] | Operating Temperature [Min] | Current Rating (Amps) | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 30 Áin | 0.76 Ám | 200 µin | 5.08 µm | Beryllium Copper | 0.1 in | 2.54 mm | Closed Frame | Solder | UL94 V-0 | 3.18 mm | 0.125 in | Gold | Through Hole | Beryllium Copper | PGA ZIF (ZIP) | 2.54 mm | 0.1 in | 125 °C | -65 ░C | 1 A | Tin |