32-6571 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS GLD

Part	Termination Post Length	Termination Post Length	Housing Material	Mounting Type	Termination	Current Rating (Amps)	Features	Type	Type	Type	Contact Finish - Mating	Material Flammability Rating	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating
Aries Electronics 32-6571-11	0.11 in	2.78 mm	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	Solder	1 A	Closed Frame	15.24 mm	DIP ZIF (ZIP)	0.6 "	Gold	UL94 V-0	Beryllium Copper	10 çin	0.25 çm	Beryllium Copper	2 x 16	32	Gold	10 çin	0.25 çm	2.54 mm	0.1 in	0.1 in	2.54 mm
Aries Electronics 32-6571-16	0.11 in	2.78 mm	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	Solder	1 A	Closed Frame	15.24 mm	DIP ZIF (ZIP)	0.6 "	Nickel Boron	UL94 V-0	Beryllium Nickel	50 µin	1.27 µm	Beryllium Nickel	2 x 16	32	Nickel Boron	50 µin	1.27 µm	2.54 mm	0.1 in	0.1 in	2.54 mm