40-8770 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 40POS GOLD
| Part | Termination Post Length | Current Rating | Material Flammability Rating | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish - Mating | Mounting Type | Row Spacing | Type | Grid Columns | Number of Positions or Pins (Grid) | Grid Rows | Contact Material - Mating | Operating Temperature (Min) | Operating Temperature (Max) | Housing Material | Contact Finish - Post | Termination | Features | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.14 in | 3 A | UL94 V-0 | 10 µin | 0.1 in | 0.1 in | 30 µin | Gold | Through Hole | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | 20 | 40 | 2 | Beryllium Copper | -55 °C | 105 °C | Glass Filled Nylon 4/6 PA46 Polyamide | Gold | Solder | Closed Frame Elevated | Brass |