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CONN IC DIP SOCKET ZIF 36POS GLD
| Part | Pitch - Mating | Pitch - Mating | Material Flammability Rating | Contact Finish - Mating | Mounting Type | Housing Material | Termination | Contact Material - Mating | Number of Positions or Pins (Grid) | Current Rating (Amps) | Contact Material - Post | Features | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Contact Finish - Post | Type | Type | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.1 in | 2.54 mm | UL94 V-0 | Gold | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | Solder | Beryllium Copper | 36 | 1 A | Beryllium Copper | Closed Frame | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | Gold | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | ||||
Aries Electronics | 0.1 in | 2.54 mm | UL94 V-0 | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | Solder | Beryllium Copper | 36 | 1 A | Beryllium Copper | Closed Frame | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | Tin | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 200 µin | 5.08 µm | 5.08 µm | 200 µin | |
Aries Electronics | 0.1 in | 2.54 mm | UL94 V-0 | Nickel Boron | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | Solder | Beryllium Copper | 36 | 1 A | Beryllium Copper | Closed Frame | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | Nickel Boron | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 50 µin | 1.27 µm | 1.27 µm | 50 µin |