IC FLASH 2MBIT SPI/DUAL I/O 8SOP
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Memory Type | Memory Size | Memory Format | Clock Frequency | Memory Organization [custom] | Memory Organization [custom] | Mounting Type | Technology | Package / Case | Package / Case [y] | Package / Case [x] | Memory Interface | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Supplier Device Package | Voltage - Supply [Max] | Voltage - Supply [Min] | Access Time | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GigaDevice Semiconductor (HK) Limited  | 85 °C  | -40 °C  | Non-Volatile  | 2 Gbit  | FLASH  | 50 MHz  | 256 K  | 8  | Surface Mount  | FLASH - NOR  | 8-SOIC  | 3.9 mm  | 0.154 in  | SPI - Dual I/O  | 6 ms  | 97 µs  | 8-SOP  | 2 V  | 1.65 V  | |
GigaDevice Semiconductor (HK) Limited  | 85 °C  | -40 °C  | Non-Volatile  | 2 Gbit  | FLASH  | 50 MHz  | 256 K  | 8  | Surface Mount  | FLASH - NOR (SLC)  | 8-XFDFN Exposed Pad  | SPI - Dual I/O  | 6 ms  | 97 µs  | 8-USON (1.5x1.5)  | 2 V  | 1.65 V  | 12 ns  | ||
GigaDevice Semiconductor (HK) Limited  | 85 °C  | -40 °C  | Non-Volatile  | 2 Gbit  | FLASH  | 50 MHz  | 256 K  | 8  | Surface Mount  | FLASH - NOR (SLC)  | 8-SOIC  | 3.9 mm  | 0.154 in  | SPI - Dual I/O  | 6 ms  | 100 µs  | 8-SOP  | 2 V  | 1.65 V  | 12 ns  | 
GigaDevice Semiconductor (HK) Limited  | 85 °C  | -40 °C  | Non-Volatile  | 2 Gbit  | FLASH  | 50 MHz  | 256 K  | 8  | Surface Mount  | FLASH - NOR (SLC)  | 8-XFDFN Exposed Pad  | SPI - Dual I/O  | 6 ms  | 100 µs  | 8-USON (1.5x1.5)  | 2 V  | 1.65 V  | 12 ns  |