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CONN IC DIP SOCKET ZIF 40POS TIN
| Part | Type | Type | Type | Contact Finish - Post | Contact Material - Mating | Contact Material - Post | Mounting Type | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Current Rating (Amps) | Housing Material | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Material Flammability Rating | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Tin | Beryllium Copper | Beryllium Copper | Through Hole | 0.11 in | 2.78 mm | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 1 A | Polyphenylene Sulfide (PPS) Glass Filled | Closed Frame | 5.08 µm | 200 µin | Solder | UL94 V-0 | 40 | 20 | 2 | 200 µin | 5.08 µm |