FTMH-108 Series
Manufacturer: Samtec Inc.
CONN HEADER SMD 16POS 1MM
| Part | Row Spacing - Mating | Contact Finish - Post | Style | Contact Finish - Mating | Current Rating (Per Contact) | Insulation Material | Contact Material | Shrouding | Features | Operating Temperature (Max) | Operating Temperature (Min) | Insulation Color | Fastening Type | Connector Type | Contact Shape | Number of Positions | Pitch - Mating | Contact Type | Termination | Number of Rows | Insulation Height | Mounting Type | Contact Finish Thickness - Mating | Number of Positions Loaded | Material Flammability Rating | Contact Length - Mating | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.039 in | Tin | Board | Gold | 2.8 A | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Unshrouded | Pick and Place | 125 °C | -55 °C | Black | Push-Pull | Header | Square | 16 | 0.039 in | Male Pin | Solder | 2 | 0.059 in | Surface Mount | 3 µin | All | UL94 V-0 | 0.075 in | |
Samtec Inc. | 0.039 in | Tin | Board | Gold | 2.8 A | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Unshrouded | Pick and Place | 125 °C | -55 °C | Black | Push-Pull | Header | Square | 16 | 0.039 in | Male Pin | Solder | 2 | 0.125 in | Right Angle Surface Mount | 10 µin | All | UL94 V-0 | 0.065 in | |
Samtec Inc. | 0.039 in | Gold | Board | Gold | 2.8 A | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Unshrouded | 125 °C | -55 °C | Black | Push-Pull | Header | Square | 16 | 0.039 in | Male Pin | Solder | 2 | 0.125 in | Right Angle Surface Mount | 30 µin | All | UL94 V-0 | 0.075 in | 3 µin | |
Samtec Inc. | 0.039 in | Tin | Board | Gold | 2.8 A | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Unshrouded | Pick and Place | 125 °C | -55 °C | Black | Push-Pull | Header | Square | 16 | 0.039 in | Male Pin | Solder | 2 | 0.125 in | Right Angle Surface Mount | 3 µin | All | UL94 V-0 | 0.065 in | |
Samtec Inc. | 0.039 in | Tin | Board | Gold | 2.8 A | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Unshrouded | End Shrouds | 125 °C | -55 °C | Black | Push-Pull | Header | Square | 16 | 0.039 in | Male Pin | Solder | 2 | 0.059 in | Surface Mount | 3 µin | All | UL94 V-0 | 0.075 in | |
Samtec Inc. | 0.039 in | Tin | Board | Gold | 2.8 A | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Unshrouded | Pick and Place | 125 °C | -55 °C | Black | Push-Pull | Header | Square | 16 | 0.039 in | Male Pin | Solder | 2 | 0.059 in | Surface Mount | 3 µin | All | UL94 V-0 | 0.065 in | |
Samtec Inc. | 0.039 in | Tin | Board | Gold | 2.8 A | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Unshrouded | 125 °C | -55 °C | Black | Push-Pull | Header | Square | 16 | 0.039 in | Male Pin | Solder | 2 | 0.059 in | Surface Mount | 3 µin | All | UL94 V-0 | 0.075 in | ||
Samtec Inc. | 0.039 in | Tin | Board | Gold | 2.8 A | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Unshrouded | 125 °C | -55 °C | Black | Push-Pull | Header | Square | 16 | 0.039 in | Male Pin | Solder | 2 | 0.059 in | Surface Mount | 10 µin | All | UL94 V-0 | 0.075 in | ||
Samtec Inc. | 0.039 in | Tin | Board | Gold | 2.8 A | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Unshrouded | Board Guide End Shrouds Pick and Place | 125 °C | -55 °C | Black | Push-Pull | Header | Square | 16 | 0.039 in | Male Pin | Solder | 2 | 0.059 in | Surface Mount | 10 µin | All | UL94 V-0 | 0.075 in | |
Samtec Inc. | 0.039 in | Tin | Board | Gold | 2.8 A | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Unshrouded | 125 °C | -55 °C | Black | Push-Pull | Header | Square | 16 | 0.039 in | Male Pin | Solder | 2 | 0.125 in | Right Angle Surface Mount | 10 µin | All | UL94 V-0 | 0.065 in |