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CONN IC DIP SOCKET 20POS GOLD
| Part | Contact Material - Mating | Mounting Type | Pitch - Mating | Pitch - Mating | Contact Material - Post [custom] | Number of Positions or Pins (Grid) | Material Flammability Rating | Housing Material | Contact Finish - Post | Current Rating (Amps) | Termination Post Length | Termination Post Length | Type | Type | Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Contact Finish - Mating | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Operating Temperature [Max] | Operating Temperature [Min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | Through Hole | 0.1 in | 2.54 mm | Brass | 20 | UL94 V-0 | Glass Filled Nylon 4/6 Polyamide (PA46) | Gold | 3 A | 3.56 mm | 0.14 in | 0.3 " | 7.62 mm | DIP | 30 Áin | 0.76 Ám | Solder | Gold | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Closed Frame Elevated | 105 ░C | -55 °C |