W25Q81 Series
Manufacturer: Winbond Electronics
IC FLASH 8MBIT SPI/QUAD 8XSON
| Part | Operating Temperature (Max) | Operating Temperature (Min) | Package Width | Package Name | Package Length | Clock Frequency | Memory Type | Memory Format | Memory Width | Memory Depth | Package / Case | Voltage - Supply (Minimum) | Voltage - Supply (Maximum) | Mounting Type | Technology | Memory Size | Memory Interface (Type) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 125 °C | -40 °C | 3 mm | 8-XSON | 2 mm | 104 MHz | Non-Volatile | FLASH | 8 bit | 1 M | 8-XFDFN Exposed Pad | 1.65 V | 1.95 V | Surface Mount | FLASH - NOR | 1 MB | SPI - Quad I/O |
Winbond Electronics | 125 °C | -40 °C | 3 mm | 8-XSON | 2 mm | 80 MHz | Non-Volatile | FLASH | 8 bit | 1 M | 8-XFDFN Exposed Pad | 2.7 V | 3.6 V | Surface Mount | FLASH - NOR | 1 MB | SPI - Quad I/O |
Winbond Electronics | 105 °C | -40 °C | 3.9 mm | 8-SOIC | 0.154 in | 80 MHz | Non-Volatile | FLASH | 8 bit | 1 M | 2.7 V | 3.6 V | Surface Mount | FLASH - NOR | 1 MB | SPI - Quad I/O | |
Winbond Electronics | 105 °C | -40 °C | 3 mm | 8-XSON | 2 mm | 104 MHz | Non-Volatile | FLASH | 8 bit | 1 M | 8-XFDFN Exposed Pad | 1.65 V | 1.95 V | Surface Mount | FLASH - NOR | 1 MB | SPI - Quad I/O |
Winbond Electronics | 125 °C | -40 °C | 5.3 mm | 8-SOIC | 0.209 in | 104 MHz | Non-Volatile | FLASH | 8 bit | 1 M | 1.65 V | 1.95 V | Surface Mount | FLASH - NOR | 1 MB | SPI - Quad I/O | |
Winbond Electronics | 105 °C | -40 °C | 3 mm | 8-XSON | 2 mm | 80 MHz | Non-Volatile | FLASH | 8 bit | 1 M | 8-XFDFN Exposed Pad | 2.7 V | 3.6 V | Surface Mount | FLASH - NOR | 1 MB | SPI - Quad I/O |
Winbond Electronics | 125 °C | -40 °C | 3.9 mm | 8-SOIC | 0.154 in | 80 MHz | Non-Volatile | FLASH | 8 bit | 1 M | 2.7 V | 3.6 V | Surface Mount | FLASH - NOR | 1 MB | SPI - Quad I/O |