CONN IC DIP SOCKET 20POS GOLD
| Part | Housing Material | Contact Finish - Mating | Contact Finish - Post | Contact Material - Post | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Termination | Current Rating (Amps) | Termination Post Length [x] | Termination Post Length [x] | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type | Type | Features | Material Flammability Rating | Contact Material - Mating | Number of Positions or Pins (Grid) | Operating Temperature [Max] | Operating Temperature [Min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Glass Filled Nylon 4/6 Polyamide (PA46) | Gold | Tin | Phosphor Bronze | 2.54 mm | 0.1 in | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Wire Wrap | 3 A | 0.36 in | 9.14 mm | Through Hole | 10 çin | 0.25 çm | 22.86 mm | DIP | 0.9 in | Closed Frame | UL94 V-0 | Beryllium Copper | 20 | 105 ░C | -55 °C |
Aries Electronics | Glass Filled Nylon 4/6 Polyamide (PA46) | Gold | Gold | Phosphor Bronze | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | Wire Wrap | 3 A | 0.36 in | 9.14 mm | Through Hole | 10 çin | 0.25 çm | 22.86 mm | DIP | 0.9 in | Closed Frame | UL94 V-0 | Beryllium Copper | 20 | 125 °C | -55 °C |