BDL Series
Manufacturer: Samtec Inc.
HEADERS & WIRE HOUSINGS .100" LOW PROFILE DOUBLE ROW
| Part | Termination | Mounting Type | Number of Positions | Contact Finish - Post | Insulation Height | Pitch - Mating | Contact Length - Mating | Number of Rows | Row Spacing - Mating | Operating Temperature (Max) | Operating Temperature (Min) | Insulation Color | Number of Positions Loaded | Contact Shape | Contact Length - Post | Contact Type | Style | Insulation Material | Overall Contact Length | Shrouding | Fastening Type | Connector Type | Contact Finish - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Solder | Through Hole | 54 | Tin | 0.07 in | 0.1 in | 0.105 in | 2 | 0.1 in | 125 °C | -55 °C | Black | All | Circular | 0.125 in | Male Pin | Board | Nylon Polyamide (PA) | 0.3 in | Unshrouded | Push-Pull | Header | Tin | |
Samtec Inc. | Solder | Through Hole | 50 | Gold | 0.085 in | 0.1 in | 0.122 in | 2 | 0.1 in | 125 °C | -55 °C | Black | All | Circular | 0.125 in | Male Pin | Board | Nylon Polyamide (PA) | 0.332 in | Unshrouded | Push-Pull | Header | Gold | 20 Ąin |
Samtec Inc. | Solder | Through Hole | 52 | Gold | 0.07 in | 0.1 in | 0.105 in | 2 | 0.1 in | 125 °C | -55 °C | Black | All | Circular | 0.125 in | Male Pin | Board | Nylon Polyamide (PA) | 0.3 in | Unshrouded | Push-Pull | Header | Gold | 20 Ąin |
Samtec Inc. | Solder | Through Hole | 54 | Gold | 0.085 in | 0.1 in | 0.122 in | 2 | 0.1 in | 125 °C | -55 °C | Black | All | Circular | 0.125 in | Male Pin | Board | Nylon Polyamide (PA) | 0.332 in | Unshrouded | Push-Pull | Header | Gold | 20 Ąin |
Samtec Inc. | Solder | Through Hole | 18 | Gold | 0.07 in | 0.1 in | 0.105 in | 2 | 0.1 in | 125 °C | -55 °C | Black | All | Circular | 0.125 in | Male Pin | Board | Nylon Polyamide (PA) | 0.3 in | Unshrouded | Push-Pull | Header | Gold | 20 Ąin |
Samtec Inc. | Solder | Through Hole | 26 | Tin | 0.07 in | 0.1 in | 0.105 in | 2 | 0.1 in | 125 °C | -55 °C | Black | All | Circular | 0.125 in | Male Pin | Board | Nylon Polyamide (PA) | 0.3 in | Unshrouded | Push-Pull | Header | Tin | |
Samtec Inc. | Solder | Through Hole | 68 | Tin | 0.07 in | 0.1 in | 0.105 in | 2 | 0.1 in | 125 °C | -55 °C | Black | All | Circular | 0.125 in | Male Pin | Board | Nylon Polyamide (PA) | 0.3 in | Unshrouded | Push-Pull | Header | Tin | |
Samtec Inc. | Solder | Through Hole | 50 | Tin | 0.085 in | 0.1 in | 0.122 in | 2 | 0.1 in | 125 °C | -55 °C | Black | All | Circular | 0.125 in | Male Pin | Board | Nylon Polyamide (PA) | 0.332 in | Unshrouded | Push-Pull | Header | Tin | |
Samtec Inc. | Solder | Through Hole | 34 | Tin | 0.085 in | 0.1 in | 0.122 in | 2 | 0.1 in | 125 °C | -55 °C | Black | All | Circular | 0.125 in | Male Pin | Board | Nylon Polyamide (PA) | 0.332 in | Unshrouded | Push-Pull | Header | Tin | |
Samtec Inc. | Solder | Through Hole | 64 | Gold | 0.085 in | 0.1 in | 0.122 in | 2 | 0.1 in | 125 °C | -55 °C | Black | All | Circular | 0.125 in | Male Pin | Board | Nylon Polyamide (PA) | 0.332 in | Unshrouded | Push-Pull | Header | Gold | 20 Ąin |