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CONN IC DIP SOCKET ZIF 32POS TIN
| Part | Pitch - Mating | Pitch - Mating | Mounting Type | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Features | Termination Post Length | Termination Post Length | Contact Material - Mating | Contact Material - Post | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Termination | Type | Type | Type | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.1 in | 2.54 mm | Through Hole | 2 x 16 | 32 | Closed Frame | 0.11 in | 2.78 mm | Beryllium Copper | Beryllium Copper | Tin | Polyphenylene Sulfide (PPS) Glass Filled | 200 µin | 5.08 µm | 1 A | Solder | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | UL94 V-0 | 5.08 µm | 200 µin | 2.54 mm | 0.1 in |
Aries Electronics | 0.1 in | 2.54 mm | Through Hole | 2 x 16 | 32 | Closed Frame | 0.11 in | 2.78 mm | Beryllium Copper | Beryllium Copper | Tin | Polyphenylene Sulfide (PPS) Glass Filled | 200 µin | 5.08 µm | 1 A | Solder | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | UL94 V-0 | 5.08 µm | 200 µin | 2.54 mm | 0.1 in |