CONN HEADER SMD 56POS 1MM
| Part | Connector Type | Termination | Number of Rows | Row Spacing - Mating | Row Spacing - Mating | Pitch - Mating | Pitch - Mating | Contact Length - Mating | Contact Length - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Contact Type | Fastening Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions | Contact Material | Shrouding | Current Rating (Amps) | Insulation Material | Contact Finish - Post | Insulation Height | Insulation Height | Number of Positions Loaded | Contact Shape | Insulation Color | Contact Finish - Mating | Material Flammability Rating | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Contact Length - Mating [x] | Contact Length - Mating [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Header | Solder | 2 | 0.039 " | 1 mm | 0.039 in | 1 mm | 0.065 in | 1.65 mm | -55 °C | 125 °C | Male Pin | Push-Pull | 10 çin | 0.25 çm | 56 | Phosphor Bronze | Unshrouded | 2.8 A per Contact | Liquid Crystal Polymer (LCP) | Tin | 1.5 mm | 0.059 " | All | Square | Black | Gold | UL94 V-0 | Surface Mount | |||||
Samtec Inc. | Header | Solder | 2 | 0.039 " | 1 mm | 0.039 in | 1 mm | 0.065 in | 1.65 mm | -55 °C | 125 °C | Male Pin | Push-Pull | 30 Áin | 0.76 Ám | 56 | Phosphor Bronze | Unshrouded | 2.8 A per Contact | Liquid Crystal Polymer (LCP) | Gold | 1.5 mm | 0.059 " | All | Square | Black | Gold | UL94 V-0 | Surface Mount | 3 µin | 0.076 µm | Board Guide End Shrouds | ||
Samtec Inc. | Header | Solder | 2 | 0.039 " | 1 mm | 0.039 in | 1 mm | -55 °C | 125 °C | Male Pin | Push-Pull | 10 çin | 0.25 çm | 56 | Phosphor Bronze | Unshrouded | 2.8 A per Contact | Liquid Crystal Polymer (LCP) | Tin | 3.18 mm | 0.125 in | All | Square | Black | Gold | UL94 V-0 | Surface Mount Right Angle | 1.9 mm | 0.075 in | |||||
Samtec Inc. | Header | Solder | 2 | 0.039 " | 1 mm | 0.039 in | 1 mm | -55 °C | 125 °C | Male Pin | Push-Pull | 10 çin | 0.25 çm | 56 | Phosphor Bronze | Unshrouded | 2.8 A per Contact | Liquid Crystal Polymer (LCP) | Tin | 1.5 mm | 0.059 " | All | Square | Black | Gold | UL94 V-0 | Surface Mount | 1.9 mm | 0.075 in | |||||
Samtec Inc. | Header | Solder | 2 | 0.039 " | 1 mm | 0.039 in | 1 mm | -55 °C | 125 °C | Male Pin | Push-Pull | 10 çin | 0.25 çm | 56 | Phosphor Bronze | Unshrouded | 2.8 A per Contact | Liquid Crystal Polymer (LCP) | Tin | 1.5 mm | 0.059 " | All | Square | Black | Gold | UL94 V-0 | Surface Mount | Board Guide End Shrouds | 1.9 mm | 0.075 in | ||||
Samtec Inc. | Header | Solder | 2 | 0.039 " | 1 mm | 0.039 in | 1 mm | 0.065 in | 1.65 mm | -55 °C | 125 °C | Male Pin | Push-Pull | 3 µin | 0.076 µm | 56 | Phosphor Bronze | Unshrouded | 2.8 A per Contact | Liquid Crystal Polymer (LCP) | Tin | 1.5 mm | 0.059 " | All | Square | Black | Gold | UL94 V-0 | Surface Mount | |||||
Samtec Inc. | Header | Solder | 2 | 0.039 " | 1 mm | 0.039 in | 1 mm | 0.065 in | 1.65 mm | -55 °C | 125 °C | Male Pin | Push-Pull | 10 çin | 0.25 çm | 56 | Phosphor Bronze | Unshrouded | 2.8 A per Contact | Liquid Crystal Polymer (LCP) | Tin | 1.5 mm | 0.059 " | All | Square | Black | Gold | UL94 V-0 | Surface Mount | Board Lock End Shrouds | ||||
Samtec Inc. | Header | Solder | 2 | 0.039 " | 1 mm | 0.039 in | 1 mm | 0.065 in | 1.65 mm | -55 °C | 125 °C | Male Pin | Push-Pull | 10 çin | 0.25 çm | 56 | Phosphor Bronze | Unshrouded | 2.8 A per Contact | Liquid Crystal Polymer (LCP) | Tin | 1.5 mm | 0.059 " | All | Square | Black | Gold | UL94 V-0 | Surface Mount | Board Guide End Shrouds |