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CONN IC DIP SOCKET 18POS GOLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Post | Pitch - Post | Operating Temperature [Max] | Operating Temperature [Min] | Number of Positions or Pins (Grid) | Termination | Material Flammability Rating | Housing Material | Current Rating (Amps) | Mounting Type | Pitch - Mating | Pitch - Mating | Features | Contact Material - Mating | Termination Post Length | Termination Post Length | Contact Material - Post [custom] | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Type | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 30 Áin | 0.76 Ám | 2.54 mm | 0.1 in | 105 ░C | -55 °C | 18 | Solder | UL94 V-0 | Glass Filled Nylon 4/6 Polyamide (PA46) | 3 A | Through Hole | 0.1 in | 2.54 mm | Closed Frame Elevated | Beryllium Copper | 3.56 mm | 0.14 in | Brass | Gold | 10 çin | 0.25 çm | DIP | 0.6 in | 15.24 mm | Gold |