08-3513 Series

Catalog

CONN IC DIP SOCKET 8POS GOLD

Part	Material Flammability Rating	Current Rating	Termination Post Length	Termination	Contact Finish - Post	Features	Mounting Type	Housing Material	Row Spacing	Type	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Post	Operating Temperature (Min)	Operating Temperature (Max)	Grid Columns	Grid Rows	Number of Positions or Pins (Grid)	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Post	Contact Material - Mating
Aries Electronics 08-3513-10H	UL94 V-0	3 A	0.125 in	Solder	Tin	Closed Frame	Through Hole	Glass Filled Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	200 µin	0.1 in	0.1 in	-55 °C	105 °C	4	2	8	Gold	10 µin	Brass	Beryllium Copper
Aries Electronics 08-3513-00	UL94 V-0	3 A	0.125 in	Solder	Tin	Closed Frame	Through Hole	Glass Filled Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	200 µin	0.1 in	0.1 in	-55 °C	105 °C	4	2	8	Gold	10 µin	Brass	Beryllium Copper
Aries Electronics 08-3513-10	UL94 V-0	3 A	0.125 in	Solder	Tin	Closed Frame	Through Hole	Glass Filled Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	200 µin	0.1 in	0.1 in	-55 °C	105 °C	4	2	8	Gold	10 µin	Brass	Beryllium Copper
Aries Electronics 08-3513-10T	UL94 V-0	3 A	0.125 in	Solder	Tin	Closed Frame	Through Hole	Glass Filled Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	200 µin	0.1 in	0.1 in	-55 °C	105 °C	4	2	8	Gold	10 µin	Brass	Beryllium Copper