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CONN IC DIP SOCKET 8POS GOLD
| Part | Material Flammability Rating | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Housing Material | Contact Material - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish - Mating | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post [custom] | Number of Positions or Pins (Grid) | Current Rating (Amps) | Features | Type | Type | Type | Termination Post Length | Termination Post Length | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Through Hole | Glass Filled Nylon 4/6 Polyamide (PA46) | Beryllium Copper | 105 ░C | -55 °C | Gold | Solder | 200 µin | 5.08 µm | Brass | 8 | 3 A | Closed Frame | 0.3 " | 7.62 mm | DIP | 3.18 mm | 0.125 in | Tin |
Aries Electronics | UL94 V-0 | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Through Hole | Glass Filled Nylon 4/6 Polyamide (PA46) | Beryllium Copper | 105 ░C | -55 °C | Gold | Solder | 200 µin | 5.08 µm | Brass | 8 | 3 A | Closed Frame | 0.3 " | 7.62 mm | DIP | 3.18 mm | 0.125 in | Tin |
Aries Electronics | UL94 V-0 | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Through Hole | Glass Filled Nylon 4/6 Polyamide (PA46) | Beryllium Copper | 105 ░C | -55 °C | Gold | Solder | 200 µin | 5.08 µm | Brass | 8 | 3 A | Closed Frame | 0.3 " | 7.62 mm | DIP | 3.18 mm | 0.125 in | Tin |
Aries Electronics | UL94 V-0 | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Through Hole | Glass Filled Nylon 4/6 Polyamide (PA46) | Beryllium Copper | 105 ░C | -55 °C | Gold | Solder | 200 µin | 5.08 µm | Brass | 8 | 3 A | Closed Frame | 0.3 " | 7.62 mm | DIP | 3.18 mm | 0.125 in | Tin |