CONN RCPT 160POS 0.05 GOLD SMD
| Part | Pitch - Mating | Pitch - Mating | Contact Material | Insulation Color | Operating Temperature [Min] | Operating Temperature [Max] | Fastening Type | Row Spacing - Mating | Row Spacing - Mating | Number of Positions | Insulation Height [z] | Insulation Height [z] | Contact Shape | Contact Type | Mounting Type | Current Rating (Amps) | Connector Type | Number of Positions Loaded | Termination | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Insulation Material | Contact Finish - Mating | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.05 in | 1.27 mm | Phosphor Bronze | Black | -55 °C | 125 °C | Push-Pull | 0.05 in | 1.27 mm | 160 | 0.16 in | 4.06 mm | Square | Forked | Surface Mount | 2.4 A | Receptacle | All | Solder | UL94 V-0 | 10 çin | 0.25 çm | Gold | 3 µin | 0.076 µm | Liquid Crystal Polymer (LCP) | Gold | |
Samtec Inc. | 0.05 in | 1.27 mm | Phosphor Bronze | Black | -55 °C | 125 °C | Push-Pull | 0.05 in | 1.27 mm | 160 | 0.16 in | 4.06 mm | Square | Forked | Surface Mount | 2.4 A | Receptacle | All | Solder | UL94 V-0 | 30 Áin | 0.76 Ám | Gold | 3 µin | 0.076 µm | Liquid Crystal Polymer (LCP) | Gold | Board Guide Pick and Place |
Samtec Inc. | 0.05 in | 1.27 mm | Phosphor Bronze | Black | -55 °C | 125 °C | Push-Pull | 0.05 in | 1.27 mm | 160 | 0.16 in | 4.06 mm | Square | Forked | Surface Mount | 2.4 A | Receptacle | All | Solder | UL94 V-0 | 10 çin | 0.25 çm | Gold | 3 µin | 0.076 µm | Liquid Crystal Polymer (LCP) | Gold | Pick and Place |
Samtec Inc. | 0.05 in | 1.27 mm | Phosphor Bronze | Black | -55 °C | 125 °C | Push-Pull | 0.05 in | 1.27 mm | 160 | 0.16 in | 4.06 mm | Square | Forked | Surface Mount | 2.4 A | Receptacle | All | Solder | UL94 V-0 | 30 Áin | 0.76 Ám | Gold | 3 µin | 0.076 µm | Liquid Crystal Polymer (LCP) | Gold | |
Samtec Inc. | 0.05 in | 1.27 mm | Phosphor Bronze | Black | -55 °C | 125 °C | Push-Pull | 0.05 in | 1.27 mm | 160 | 0.16 in | 4.06 mm | Square | Forked | Surface Mount | 2.4 A | Receptacle | All | Solder | UL94 V-0 | 10 çin | 0.25 çm | Gold | 3 µin | 0.076 µm | Liquid Crystal Polymer (LCP) | Gold | Board Guide Pick and Place |
Samtec Inc. | 0.05 in | 1.27 mm | Phosphor Bronze | Black | -55 °C | 125 °C | Push-Pull | 0.05 in | 1.27 mm | 160 | 0.16 in | 4.06 mm | Square | Forked | Surface Mount | 2.4 A | Receptacle | All | Solder | UL94 V-0 | 30 Áin | 0.76 Ám | Gold | 3 µin | 0.076 µm | Liquid Crystal Polymer (LCP) | Gold | Board Guide |
Samtec Inc. | 0.05 in | 1.27 mm | Phosphor Bronze | Black | -55 °C | 125 °C | Push-Pull | 0.05 in | 1.27 mm | 160 | 0.16 in | 4.06 mm | Square | Forked | Surface Mount | 2.4 A | Receptacle | All | Solder | UL94 V-0 | 3 µin | 0.076 µm | Gold | 3 µin | 0.076 µm | Liquid Crystal Polymer (LCP) | Gold | Pick and Place |
Samtec Inc. | 0.05 in | 1.27 mm | Phosphor Bronze | Black | -55 °C | 125 °C | Push-Pull | 0.05 in | 1.27 mm | 160 | 0.16 in | 4.06 mm | Square | Forked | Surface Mount | 2.4 A | Receptacle | All | Solder | UL94 V-0 | 3 µin | 0.076 µm | Gold | 3 µin | 0.076 µm | Liquid Crystal Polymer (LCP) | Gold | Board Guide Pick and Place |
Samtec Inc. | 0.05 in | 1.27 mm | Phosphor Bronze | Black | -55 °C | 125 °C | Push-Pull | 0.05 in | 1.27 mm | 160 | 0.16 in | 4.06 mm | Square | Forked | Surface Mount | 2.4 A | Receptacle | All | Solder | UL94 V-0 | 30 Áin | 0.76 Ám | Gold | 3 µin | 0.076 µm | Liquid Crystal Polymer (LCP) | Gold | Pick and Place |
Samtec Inc. | 0.05 in | 1.27 mm | Phosphor Bronze | Black | -55 °C | 125 °C | Push-Pull | 0.05 in | 1.27 mm | 160 | 0.16 in | 4.06 mm | Square | Forked | Surface Mount | 2.4 A | Receptacle | All | Solder | UL94 V-0 | 3 µin | 0.076 µm | Gold | 3 µin | 0.076 µm | Liquid Crystal Polymer (LCP) | Gold | Board Guide Pick and Place |