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CONN IC DIP SOCKET 28POS TIN
| Part | Features | Pitch - Post | Pitch - Post | Contact Material - Post | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions or Pins (Grid) | Housing Material | Contact Finish - Post | Termination | Type | Type | Type | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Open Frame | 2.54 mm | 0.1 in | Beryllium Copper | Beryllium Copper | 0.1 in | 2.54 mm | -55 °C | 125 °C | 28 | Liquid Crystal Polymer (LCP) | Tin | Solder | DIP | 0.6 in | 15.24 mm | Surface Mount |