44-6574 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS TIN

Part	Termination Post Length	Material Flammability Rating	Current Rating	Pitch - Post	Contact Material - Post	Contact Finish - Mating	Number of Positions or Pins (Grid)	Grid Rows	Grid Columns	Contact Finish - Post	Row Spacing	Type	Termination	Pitch - Mating	Contact Finish Thickness - Post	Contact Material - Mating	Housing Material	Mounting Type	Features	Contact Finish Thickness - Mating
Aries Electronics 44-6574-10	0.11 in	UL94 V-0	1 A	0.1 in	Beryllium Copper	Tin	44	2	22	Tin	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Solder	0.1 in	200 µin	Beryllium Copper	Glass Filled Polyphenylene Sulfide PPS	Through Hole	Closed Frame	200 Ąin
Aries Electronics 44-6574-18	0.11 in	UL94 V-0	1 A	0.1 in	Beryllium Copper	Tin	44	2	22	Tin	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Solder	0.1 in	200 µin	Beryllium Copper	Glass Filled Polyphenylene Sulfide PPS	Through Hole	Closed Frame	200 Ąin
Aries Electronics 44-6574-16	0.11 in	UL94 V-0	1 A	0.1 in	Beryllium Copper	Tin	44	2	22	Tin	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Solder	0.1 in	200 µin	Beryllium Copper	Glass Filled Polyphenylene Sulfide PPS	Through Hole	Closed Frame	200 Ąin
Aries Electronics 44-6574-11	0.11 in	UL94 V-0	1 A	0.1 in	Beryllium Copper	Tin	44	2	22	Tin	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Solder	0.1 in	200 µin	Beryllium Copper	Glass Filled Polyphenylene Sulfide PPS	Through Hole	Closed Frame	200 Ąin