44-6574 Series
Manufacturer: Aries Electronics
Catalog
CONN IC DIP SOCKET ZIF 44POS TIN
| Part | Type | Type | Type | Termination | Mounting Type | Contact Finish - Post | Contact Material - Post | Housing Material | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Contact Material - Mating | Current Rating (Amps) | Number of Positions or Pins (Grid) | Material Flammability Rating | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Solder | Through Hole | Tin | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | 0.11 in | 2.78 mm | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | Closed Frame | Beryllium Copper | 1 A | 44 Positions or Pins | UL94 V-0 | 2.54 mm | 0.1 in | 5.08 µm | 200 µin |
Aries Electronics | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Solder | Through Hole | Tin | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | 0.11 in | 2.78 mm | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | Closed Frame | Beryllium Copper | 1 A | 44 Positions or Pins | UL94 V-0 | 2.54 mm | 0.1 in | 5.08 µm | 200 µin |
Aries Electronics | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Solder | Through Hole | Tin | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | 0.11 in | 2.78 mm | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | Closed Frame | Beryllium Copper | 1 A | 44 Positions or Pins | UL94 V-0 | 2.54 mm | 0.1 in | 5.08 µm | 200 µin |
Aries Electronics | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Solder | Through Hole | Tin | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | 0.11 in | 2.78 mm | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | Closed Frame | Beryllium Copper | 1 A | 44 Positions or Pins | UL94 V-0 | 2.54 mm | 0.1 in | 5.08 µm | 200 µin |