20-8100 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 20POS GOLD
| Part | Material Flammability Rating | Current Rating | Termination Post Length | Contact Finish - Mating | Pitch - Mating | Termination | Grid Rows | Grid Columns | Number of Positions or Pins (Grid) | Features | Contact Finish - Post | Contact Finish Thickness - Mating | Row Spacing | Type | Contact Material - Post | Pitch - Post | Operating Temperature (Min) | Operating Temperature (Max) | Contact Finish Thickness - Post | Mounting Type | Contact Material - Mating | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 3 A | 0.14 in | Gold | 0.1 in | Solder | 2 | 10 | 20 | Closed Frame Elevated | Gold | 30 µin | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Brass | 0.1 in | -55 °C | 105 °C | 10 µin | Through Hole | Beryllium Copper | Glass Filled Nylon 4/6 PA46 Polyamide |
Aries Electronics | UL94 V-0 | 3 A | 0.14 in | Gold | 0.1 in | Solder | 2 | 10 | 20 | Closed Frame Elevated | Gold | 30 µin | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Brass | 0.1 in | -55 °C | 105 °C | 10 µin | Through Hole | Beryllium Copper | Glass Filled Nylon 4/6 PA46 Polyamide |