SEAMP-30 Series

Catalog

CONN HD ARRAY M 180POS PRESS-FIT

Part	Contact Finish	Contact Finish Thickness	Connector Type	Pitch	Mated Stacking Height Options	Number of Positions	Mounting Type	Height Above Board	Number of Rows	Features
Samtec Inc. SEAMP-30-02.0-S-06	Gold	30 µin	High Density Array MALE	0.05 in	7mm 8.5mm 8mm	180	Through Hole	0.181 in	6
Samtec Inc. SEAMP-30-02.0-L-04	Gold	10 Ąin	High Density Array MALE	0.05 in	7mm 8.5mm 8mm	120	Through Hole	0.181 in	4
Samtec Inc. SEAMP-30-02.0-L-06	Gold	10 Ąin	High Density Array MALE	0.05 in	7mm 8.5mm 8mm	180	Through Hole	0.181 in	6
Samtec Inc. SEAMP-30-02.0-S-10-GP	Gold	30 µin	High Density Array MALE	0.05 in	7mm 8.5mm 8mm	300	Through Hole	0.181 in	10	Board Guide