SEAMP-30 Series

Catalog

CONN HD ARRAY M 180POS PRESS-FIT

Part	Mated Stacking Heights	Contact Finish Thickness	Contact Finish Thickness	Height Above Board	Height Above Board	Mounting Type	Number of Rows	Connector Type	Contact Finish	Pitch [x]	Pitch [x]	Number of Positions	Features
Samtec Inc. SEAMP-30-02.0-S-06	7 mm 8 mm 8.5 mm	0.76 Ám	30 Áin	0.181 in	4.6 mm	Through Hole	6	High Density Array Male	Gold	0.05 in	1.27 mm	180
Samtec Inc. SEAMP-30-02.0-L-04	7 mm 8 mm 8.5 mm	0.25 Ám	10 Áin	0.181 in	4.6 mm	Through Hole		High Density Array Male	Gold	0.05 in	1.27 mm	120
Samtec Inc. SEAMP-30-02.0-L-06	7 mm 8 mm 8.5 mm	0.25 Ám	10 Áin	0.181 in	4.6 mm	Through Hole	6	High Density Array Male	Gold	0.05 in	1.27 mm	180
Samtec Inc. SEAMP-30-02.0-S-10-GP	7 mm 8 mm 8.5 mm	0.76 Ám	30 Áin	0.181 in	4.6 mm	Through Hole	10	High Density Array Male	Gold	0.05 in	1.27 mm	300	Board Guide