50-9513 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 50POS GOLD
| Part | Current Rating | Material Flammability Rating | Termination Post Length | Contact Finish Thickness - Mating | Contact Finish - Post | Grid Columns | Grid Rows | Number of Positions or Pins (Grid) | Contact Material - Post | Features | Housing Material | Pitch - Post | Contact Finish - Mating | Pitch - Mating | Termination | Operating Temperature (Min) | Operating Temperature (Max) | Contact Finish Thickness - Post | Contact Material - Mating | Mounting Type | Row Spacing | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 3 A | UL94 V-0 | 0.125 in | 10 µin | Gold | 25 | 2 | 50 | Brass | Closed Frame | Glass Filled Nylon 4/6 PA46 Polyamide | 0.1 in | Gold | 0.1 in | Solder | -55 °C | 105 °C | 10 µin | Beryllium Copper | Through Hole | 0.9 in | 0.9" (22.86mm) Row Spacing DIP |
Aries Electronics | 3 A | UL94 V-0 | 0.125 in | 10 µin | Gold | 25 | 2 | 50 | Brass | Closed Frame | Glass Filled Nylon 4/6 PA46 Polyamide | 0.1 in | Gold | 0.1 in | Solder | -55 °C | 105 °C | 10 µin | Beryllium Copper | Through Hole | 0.9 in | 0.9" (22.86mm) Row Spacing DIP |
Aries Electronics | 3 A | UL94 V-0 | 0.125 in | 10 µin | Tin | 25 | 2 | 50 | Brass | Closed Frame | Glass Filled Nylon 4/6 PA46 Polyamide | 0.1 in | Gold | 0.1 in | Solder | -55 °C | 105 °C | 200 µin | Beryllium Copper | Through Hole | 0.9 in | 0.9" (22.86mm) Row Spacing DIP |
Aries Electronics | 3 A | UL94 V-0 | 0.125 in | 10 µin | Tin | 25 | 2 | 50 | Brass | Closed Frame | Glass Filled Nylon 4/6 PA46 Polyamide | 0.1 in | Gold | 0.1 in | Solder | -55 °C | 105 °C | 200 µin | Beryllium Copper | Through Hole | 0.9 in | 0.9" (22.86mm) Row Spacing DIP |