CONN SOCKET PGA ZIF GOLD
| Part | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Mounting Type | Contact Material - Post | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Material Flammability Rating | Operating Temperature [Max] | Operating Temperature [Min] | Termination | Current Rating (Amps) | Contact Finish - Mating | Contact Finish - Post | Termination Post Length | Termination Post Length | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | Through Hole | Beryllium Copper | Closed Frame | 200 µin | 5.08 µm | UL94 V-0 | 125 °C | -65 ░C | Solder | 1 A | Gold | Tin | 3.18 mm | 0.125 in | PGA ZIF (ZIP) |
Aries Electronics | Beryllium Copper | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | Through Hole | Beryllium Copper | Closed Frame | 200 µin | 5.08 µm | UL94 V-0 | 125 °C | -65 ░C | Solder | 1 A | Gold | Tin | 3.18 mm | 0.125 in | PGA ZIF (ZIP) |