24-516 Series

Catalog

CONN IC DIP SOCKET ZIF 24POS GLD

Part	Contact Material - Post	Pitch - Mating	Pitch - Mating	Type	Current Rating (Amps)	Termination	Contact Material - Mating	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Contact Finish - Post	Termination Post Length	Termination Post Length	Housing Material	Contact Finish - Mating	Features	Mounting Type
Aries Electronics 24-516-11S	Beryllium Copper	0.1 in	2.54 mm	DIP ZIF (ZIP)	1 A	Solder	Beryllium Copper	UL94 V-0	10 çin	0.25 çm	2.54 mm	0.1 in	10 çin	0.25 çm	24	Gold	0.15 in	3.81 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	Closed Frame	Through Hole
Aries Electronics 24-516-11M	Beryllium Copper	0.1 in	2.54 mm	DIP ZIF (ZIP)	1 A	Solder	Beryllium Copper	UL94 V-0	10 çin	0.25 çm	2.54 mm	0.1 in	10 çin	0.25 çm	24	Gold	0.15 in	3.81 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	Closed Frame	Through Hole
Aries Electronics 24-516-11	Beryllium Copper	0.1 in	2.54 mm	DIP ZIF (ZIP)	1 A	Solder	Beryllium Copper	UL94 V-0	10 çin	0.25 çm	2.54 mm	0.1 in	10 çin	0.25 çm	24	Gold	0.15 in	3.81 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	Closed Frame	Through Hole