IC MEMORY
| Part | Package / Case | Operating Temperature [Max] | Operating Temperature [Min] | Memory Interface | Memory Organization | Write Cycle Time - Word, Page | Memory Type | Mounting Type | Supplier Device Package | Voltage - Supply [Max] | Voltage - Supply [Min] | Technology | Memory Format | Memory Size | Access Time | Package / Case [y] | Package / Case [y] | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GigaDevice Semiconductor (HK) Limited  | 63-VFBGA  | 85 °C  | -40 °C  | ONFI  | 512 M  | 25 ns  | Non-Volatile  | Surface Mount  | 63-FBGA (9x11)  | 1.95 V  | 1.7 V  | FLASH - NAND (SLC)  | FLASH  | 512 kb  | 22 ns  | ||
GigaDevice Semiconductor (HK) Limited  | FLASH - NAND  | FLASH  | |||||||||||||||
GigaDevice Semiconductor (HK) Limited  | 63-VFBGA  | 85 °C  | -40 °C  | ONFI  | 512 M  | 25 ns  | Non-Volatile  | Surface Mount  | 63-FBGA (9x11)  | 1.95 V  | 1.7 V  | FLASH - NAND (SLC)  | FLASH  | 512 kb  | 22 ns  | ||
GigaDevice Semiconductor (HK) Limited  | 63-VFBGA  | 105 °C  | -40 °C  | ONFI  | 512 M  | 25 ns  | Non-Volatile  | Surface Mount  | 63-FBGA (9x11)  | 1.95 V  | 1.7 V  | FLASH - NAND (SLC)  | FLASH  | 512 kb  | 22 ns  | ||
GigaDevice Semiconductor (HK) Limited  | 48-TFSOP  | 85 °C  | -40 °C  | ONFI  | 512 M  | 25 ns  | Non-Volatile  | Surface Mount  | 48-TSOP I  | 1.95 V  | 1.7 V  | FLASH - NAND (SLC)  | FLASH  | 512 kb  | 22 ns  | 18.4 mm  | 0.724 in  |