MPC5566 Series
Manufacturer: NXP USA Inc.
EVALUATION KIT, MPC55XX FAMILY OF MCU'S, BREADBOARD AREA, CAN/LIN/PHY, AUDIO SPEAKER
| Part | Board Type | Core Processor | Utilized IC / Part | Contents | Mounting Type | Type | A/D Channels | A/D Resolution (bits) | Program Memory Width | Program Memory Depth | Program Memory Size | Operating Temperature (Max) | Operating Temperature (Min) | Package / Case | Speed | Package Width | Package Name | Package Length | RAM Size Width | RAM Size Depth | Connectivity | Core Size (Bit Width) | Program Memory Type | Oscillator Type | Voltage - Supply (Vcc/Vdd) Minimum | Voltage - Supply (Vcc/Vdd) Maximum | Number of I/O | Peripherals | Core Configuration |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. | Evaluation Platform | e200 | MPC5566 | Board | Fixed | MCU 32-Bit | |||||||||||||||||||||||
NXP USA Inc. | e200z6 | Surface Mount | 40 count | 12 bit | 8 bit | 3 M | 3 MB | 125 °C | -40 °C | 416-BBGA | 132 MHz | 27 mm | 416-PBGA | 27 mm | 8 bit | 128 K | CANbus EBI EMI Ethernet SCI SPI | 32 Bit | FLASH | External | 1.35 V | 1.65 V | 256 | DMA POR PWM WDT | Single-Core | ||||
NXP USA Inc. | e200z6 | Surface Mount | 40 count | 12 bit | 8 bit | 3 M | 3 MB | 125 °C | -40 °C | 416-BBGA | 132 MHz | 27 mm | 416-PBGA | 27 mm | 8 bit | 128 K | CANbus EBI EMI Ethernet SCI SPI | 32 Bit | FLASH | External | 1.35 V | 1.65 V | 256 | DMA POR PWM WDT | Single-Core |