SDL-135 Series

Catalog

CONN RCPT 70POS 0.1 GOLD PCB

Part	Row Spacing - Mating	Contact Finish - Mating	Insulation Material	Termination	Number of Positions	Insulation Color	Style	Fastening Type	Contact Type	Operating Temperature (Max)	Operating Temperature (Min)	Number of Positions Loaded	Insulation Height	Pitch - Mating	Contact Length - Post	Contact Finish Thickness - Mating	Contact Shape	Number of Rows	Connector Type	Contact Material	Mounting Type	Contact Finish - Post
Samtec Inc. SDL-135-T-11	0.1 in	Gold	Liquid Crystal Polymer (LCP)	Solder	70	Black	Board	Push-Pull	Female Socket	125 °C	-55 °C	All	0.132 in	0.1 in	0.108 in	30 µin	Circular	2	Receptacle	Beryllium Copper	Through Hole
Samtec Inc. SDL-135-TT-12	0.1 in	Tin	Liquid Crystal Polymer (LCP)	Solder	70	Black	Board	Push-Pull	Female Socket	105 °C	-55 °C	All	0.095 in	0.1 in	0.095 in		Circular	2	Receptacle	Beryllium Copper	Through Hole	Tin
Samtec Inc. SDL-135-TT-10	0.1 in	Tin	Liquid Crystal Polymer (LCP)	Solder	70	Black	Board	Push-Pull	Female Socket	105 °C	-55 °C	All	0.122 in	0.1 in	0.108 in		Circular	2	Receptacle	Beryllium Copper	Through Hole	Tin
Samtec Inc. SDL-135-T-10	0.1 in	Gold	Liquid Crystal Polymer (LCP)	Solder	70	Black	Board	Push-Pull	Female Socket	125 °C	-55 °C	All	0.122 in	0.1 in	0.108 in	30 µin	Circular	2	Receptacle	Beryllium Copper	Through Hole
Samtec Inc. SDL-135-T-12	0.1 in	Gold	Liquid Crystal Polymer (LCP)	Solder	70	Black	Board	Push-Pull	Female Socket	125 °C	-55 °C	All	0.095 in	0.1 in	0.095 in	30 µin	Circular	2	Receptacle	Beryllium Copper	Through Hole