CONN SOCKET 0.1 GOLD PCB
| Part | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Voltage Rating | Operating Temperature [Min] | Operating Temperature [Max] | Fastening Type | Contact Finish - Mating | Contact Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions Loaded | Termination | Insulation Color | Contact Shape | Current Rating (Amps) | Insulation Material | Material Flammability Rating | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Number of Rows | Insulation Height | Insulation Height | Contact Length - Post [x] | Contact Length - Post [x] | Connector Type | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.1 in | 2.54 mm | Gold | 550 VAC | -55 °C | 125 °C | Push-Pull | Gold | Phosphor Bronze | 0.51 µm | 20 µin | All | Solder | Black | Square | 5.7 A | Liquid Crystal Polymer (LCP) | UL94 V-0 | 2.54 mm | 0.1 in | 3 | 0.435 in | 11.05 mm | 0.29 " | 7.37 mm | Elevated Socket | Through Hole | 3 µin | 0.076 µm | Forked |