IC FLASH 256MBIT SPI/QUAD 8WSON
| Part | Memory Organization | Supplier Device Package | Mounting Type | Voltage - Supply [Min] | Voltage - Supply [Max] | Memory Type | Memory Size | Operating Temperature [Min] | Operating Temperature [Max] | Memory Format | Clock Frequency | Technology | Memory Interface | Package / Case | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Access Time | Package / Case [x] | Package / Case [y] | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GigaDevice Semiconductor (HK) Limited  | 32 M  | 8-WSON (6x8)  | Surface Mount  | 2.7 V  | 3.6 V  | Non-Volatile  | 256 Gbit  | -40 °C  | 125 °C  | FLASH  | 133 MHz  | FLASH - NOR (SLC)  | SPI - Quad I/O  | 8-WDFN Exposed Pad  | |||||
GigaDevice Semiconductor (HK) Limited  | 32 M  | 8-WSON (5x6)  | Surface Mount  | 2.7 V  | 3.6 V  | Non-Volatile  | 256 Gbit  | -40 °C  | 85 °C  | FLASH  | 133 MHz  | FLASH - NOR (SLC)  | SPI - Quad I/O  | 8-WDFN Exposed Pad  | 90 µs  | 2 ms  | 7 ns  | ||
GigaDevice Semiconductor (HK) Limited  | 32 M  | 8-WSON (5x6)  | Surface Mount  | 2.7 V  | 3.6 V  | Non-Volatile  | 256 Gbit  | -40 °C  | 105 °C  | FLASH  | 133 MHz  | FLASH - NOR (SLC)  | SPI - Quad I/O  | 8-WDFN Exposed Pad  | |||||
GigaDevice Semiconductor (HK) Limited  | 32 M  | 8-WSON (6x8)  | Surface Mount  | 2.7 V  | 3.6 V  | Non-Volatile  | 256 Gbit  | -40 °C  | 105 °C  | FLASH  | 133 MHz  | FLASH - NOR (SLC)  | SPI - Quad I/O  | 8-WDFN Exposed Pad  | |||||
GigaDevice Semiconductor (HK) Limited  | 32 M  | 16-SOP  | Surface Mount  | 2.7 V  | 3.6 V  | Non-Volatile  | 256 Gbit  | -40 °C  | 85 °C  | FLASH  | 104 MHz  | FLASH - NOR  | SPI - Quad I/O  | 16-SOIC  | 50 µs  | 2.4 ms  | 0.295 in  | 7.5 mm  | |
GigaDevice Semiconductor (HK) Limited  | 32 M  | 8-WSON (6x8)  | Surface Mount  | 2.7 V  | 3.6 V  | Non-Volatile  | 256 Gbit  | -40 °C  | 85 °C  | FLASH  | 133 MHz  | FLASH - NOR (SLC)  | SPI - Quad I/O  | 8-WDFN Exposed Pad  | |||||
GigaDevice Semiconductor (HK) Limited  | 32 M  | 8-WSON (5x6)  | Surface Mount  | 2.7 V  | 3.6 V  | Non-Volatile  | 256 Gbit  | -40 °C  | 85 °C  | FLASH  | 133 MHz  | FLASH - NOR (SLC)  | SPI - Quad I/O  | 8-WDFN Exposed Pad  | |||||
GigaDevice Semiconductor (HK) Limited  | 32 M  | 16-SOP  | Surface Mount  | 2.7 V  | 3.6 V  | Non-Volatile  | 256 Gbit  | -40 °C  | 105 °C  | FLASH  | 133 MHz  | FLASH - NOR (SLC)  | SPI - Quad I/O  | 16-SOIC  | 0.295 in  | 7.5 mm  | |||
GigaDevice Semiconductor (HK) Limited  | 32 M  | 16-SOP  | Surface Mount  | 2.7 V  | 3.6 V  | Non-Volatile  | 256 Gbit  | -40 °C  | 85 °C  | FLASH  | 133 MHz  | FLASH - NOR (SLC)  | SPI - Quad I/O  | 16-SOIC  | 0.295 in  | 7.5 mm  | |||
GigaDevice Semiconductor (HK) Limited  | 32 M  | 24-TFBGA (6x8)  | Surface Mount  | 2.7 V  | 3.6 V  | Non-Volatile  | 256 Gbit  | -40 °C  | 85 °C  | FLASH  | 133 MHz  | FLASH - NOR (SLC)  | SPI - Quad I/O  | 24-TBGA  |