42-3551 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 42POS GLD
| Part | Termination Post Length | Current Rating | Material Flammability Rating | Termination | Pitch - Mating | Housing Material | Pitch - Post | Row Spacing | Type | Features | Contact Finish - Mating | Contact Material - Post | Number of Positions or Pins (Grid) | Grid Columns | Grid Rows | Contact Material - Mating | Mounting Type | Contact Finish - Post | Operating Temperature (Max) | Operating Temperature (Min) | Contact Finish Thickness - Post | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.11 in | 1 A | UL94 V-0 | Solder | 0.1 in | Glass Filled Polyphenylene Sulfide PPS | 0.1 in | 0.3 in | 0.3" (7.62mm) Row Spacing DIP ZIF (ZIP) | Closed Frame | Gold | Beryllium Copper | 42 | 21 | 2 | Beryllium Copper | Through Hole | Gold | ||||
Aries Electronics | 0.11 in | 1 A | UL94 V-0 | Solder | 0.1 in | Glass Filled PEEK Polyetheretherketone | 0.1 in | 0.3 in | 0.3" (7.62mm) Row Spacing DIP ZIF (ZIP) | Closed Frame | Boron Nickel | Beryllium Nickel | 42 | 21 | 2 | Beryllium Nickel | Through Hole | Nickel Boron | 250 °C | -55 °C | 50 µin | 50 µin |
Aries Electronics | 0.11 in | 1 A | UL94 V-0 | Solder | 0.1 in | Glass Filled Polyphenylene Sulfide PPS | 0.1 in | 0.3 in | 0.3" (7.62mm) Row Spacing DIP ZIF (ZIP) | Closed Frame | Boron Nickel | Beryllium Copper | 42 | 21 | 2 | Beryllium Copper | Through Hole | Nickel Boron | 50 µin | 50 µin |