CONN IC DIP SOCKET ZIF 48POS
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post | Number of Positions or Pins (Grid) | Material Flammability Rating | Termination | Features | Contact Material - Mating | Contact Finish - Mating | Housing Material | Current Rating (Amps) | Pitch - Post | Pitch - Post | Type | Type | Type | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination Post Length | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 48-3572-16 | 1.27 µm | 50 µin | Beryllium Nickel | 48 | UL94 V-0 | Solder | Closed Frame | Beryllium Nickel | Nickel Boron | Polyphenylene Sulfide (PPS), Glass Filled | 1 A | 2.54 mm | 0.1 in | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | 0.1 in | 2.54 mm | Nickel Boron | Through Hole | 1.27 µm | 50 µin | 0.11 in | 2.78 mm |
Aries Electronics 48-3572-10 | 5.08 µm | 200 µin | Beryllium Copper | 48 | UL94 V-0 | Solder | Closed Frame | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | 1 A | 2.54 mm | 0.1 in | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | 0.1 in | 2.54 mm | Tin | Through Hole | 5.08 µm | 200 µin | 0.11 in | 2.78 mm | |
Aries Electronics 48-3572-11 | 0.25 çm | 10 çin | Beryllium Copper | 48 | UL94 V-0 | Solder | Closed Frame | Beryllium Copper | Gold | Polyphenylene Sulfide (PPS), Glass Filled | 1 A | 2.54 mm | 0.1 in | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | 0.1 in | 2.54 mm | Gold | Through Hole | 0.25 çm | 10 çin | 0.11 in | 2.78 mm |