08-3508 Series

Catalog

CONN IC DIP SOCKET 8POS GOLD

Part	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Features	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Housing Material	Current Rating (Amps)	Mounting Type	Contact Finish - Post	Termination Post Length	Termination Post Length	Contact Finish - Mating	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Termination	Pitch - Post	Pitch - Post	Operating Temperature [Min]	Operating Temperature [Max]	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 08-3508-31	UL94 V-0	0.1 in	2.54 mm	Open Frame	Beryllium Copper	10 çin	0.25 çm	0.3 "	7.62 mm	DIP	Glass Filled Nylon 4/6 Polyamide (PA46)	3 A	Through Hole	Gold	0.5 in	12.7 mm	Gold	Brass	30 Áin	0.76 Ám	8	Wire Wrap	2.54 mm	0.1 in	-55 °C	125 °C
Aries Electronics 08-3508-21	UL94 V-0	0.1 in	2.54 mm	Open Frame	Beryllium Copper	10 çin	0.25 çm	0.3 "	7.62 mm	DIP	Glass Filled Nylon 4/6 Polyamide (PA46)	3 A	Through Hole	Gold			Gold	Brass	30 Áin	0.76 Ám	8	Wire Wrap	2.54 mm	0.1 in	-55 °C	125 °C	0.36 in	9.14 mm