HMTSW-112 Series

Catalog

CONN UNSHROUDED HEADER HDR 12 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

Part	Material Flammability Rating	Number of Rows	Mounting Type	Contact Length - Post	Contact Finish - Post	Contact Length - Mating	Insulation Material	Insulation Height	Termination	Current Rating	Overall Contact Length	Shrouding	Contact Finish - Mating	Fastening Type	Insulation Color	Contact Finish Thickness - Mating	Contact Shape	Style	Contact Material	Number of Positions	Number of Positions Loaded	Operating Temperature (Max)	Operating Temperature (Min)	Contact Type	Connector Type	Pitch - Mating	Row Spacing - Mating	Contact Finish Thickness - Post
Samtec Inc. HMTSW-112-23-L-S-230	UL94 V-0	1	Through Hole	0.115 in	Tin	0.23 in	Liquid Crystal Polymer (LCP)	0.1 in	Solder	3 A	0.445 in	Unshrouded	Gold	Push-Pull	Natural	10 µin	Square	Board Board or Cable	Phosphor Bronze	12	All	125 °C	-55 °C	Male Pin	Header	0.1 in
Samtec Inc. HMTSW-112-09-S-D-090-RA	UL94 V-0	2	Right Angle Through Hole		Tin	0.09 in	Liquid Crystal Polymer (LCP)	0.24 in	Solder	3 A		Unshrouded	Gold	Push-Pull	Natural	30 µin	Square	Board Board or Cable	Phosphor Bronze	24 pos	All	125 °C	-55 °C	Male Pin	Header	0.1 in	0.1 in
Samtec Inc. HMTSW-112-09-L-D-500	UL94 V-0	2	Through Hole	0.13 in	Tin	0.5 in	Liquid Crystal Polymer (LCP)	0.1 in	Solder	3 A	0.73 in	Unshrouded	Gold	Push-Pull	Natural	10 µin	Square	Board Board or Cable	Phosphor Bronze	24 pos	All	125 °C	-55 °C	Male Pin	Header	0.1 in	0.1 in
Samtec Inc. HMTSW-112-07-G-S-180	UL94 V-0	1	Through Hole	0.15 in	Gold	0.18 in	Liquid Crystal Polymer (LCP)	0.1 in	Solder	3 A	0.43 in	Unshrouded	Gold	Push-Pull	Natural	10 µin	Square	Board Board or Cable	Phosphor Bronze	12	All	125 °C	-55 °C	Male Pin	Header	0.1 in		3 µin
Samtec Inc. HMTSW-112-08-TM-S-300	UL94 V-0	1	Through Hole	0.13 in	Tin	0.3 in	Liquid Crystal Polymer (LCP)	0.1 in	Solder	3 A	0.53 in	Unshrouded	Tin	Push-Pull	Natural		Square	Board Board or Cable	Phosphor Bronze	12	All	105 °C	-55 °C	Male Pin	Header	0.1 in
Samtec Inc. HMTSW-112-22-T-S-420	UL94 V-0	1	Through Hole	0.11 in	Tin	0.42 in	Liquid Crystal Polymer (LCP)	0.1 in	Solder	3 A	0.63 in	Unshrouded	Tin	Push-Pull	Natural		Square	Board Board or Cable	Phosphor Bronze	12	All	105 °C	-55 °C	Male Pin	Header	0.1 in
Samtec Inc. HMTSW-112-13-T-D-995-LL	UL94 V-0	2	Through Hole	0.135 in	Tin	0.995 in	Liquid Crystal Polymer (LCP)	0.1 in	Kinked Pin Solder	3 A	1.23 in	Unshrouded	Tin	Push-Pull	Natural		Square	Board Board or Cable	Phosphor Bronze	24 pos	All	105 °C	-55 °C	Male Pin	Header	0.1 in	0.1 in
Samtec Inc. HMTSW-112-24-T-D-275	UL94 V-0	2	Through Hole	0.105 in	Tin	0.275 in	Liquid Crystal Polymer (LCP)	0.1 in	Solder	3 A	0.48 in	Unshrouded	Tin	Push-Pull	Natural		Square	Board Board or Cable	Phosphor Bronze	24 pos	All	105 °C	-55 °C	Male Pin	Header	0.1 in	0.1 in
Samtec Inc. HMTSW-112-09-S-S-540	UL94 V-0	1	Through Hole	0.09 in	Tin	0.54 in	Liquid Crystal Polymer (LCP)	0.1 in	Solder	3 A	0.73 in	Unshrouded	Gold	Push-Pull	Natural	30 µin	Square	Board Board or Cable	Phosphor Bronze	12	All	125 °C	-55 °C	Male Pin	Header	0.1 in
Samtec Inc. HMTSW-112-12-G-D-340	UL94 V-0	2	Through Hole	0.59 in	Gold	0.34 in	Liquid Crystal Polymer (LCP)	0.1 in	Solder	3 A	1.03 in	Unshrouded	Gold	Push-Pull	Natural	10 µin	Square	Board Board or Cable	Phosphor Bronze	24 pos	All	125 °C	-55 °C	Male Pin	Header	0.1 in	0.1 in	3 µin