SOLDER WIRE SN42/BI58 .047" 4OZ
| Part | Composition | Diameter [diameter] | Diameter [diameter] | Type | Melting Point [custom] | Melting Point [custom] | Form | Form | Form | Form | Flux Type | Process |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc. SMD3SWLT.047 4OZ | Bi58Sn42 (58/42) | 1.19 mm | 0.047 in | Wire Solder | 138 °C | 280 °F | Spool | 4 oz | 113.4 g | |||
Chip Quik Inc. SMD3SWLT.040 10G | Bi58Sn42 (58/42) | 1.02 mm | 0.04 in | Wire Solder | 138 °C | 280 °F | Spool | 0.35 oz | 10 g | No-Clean, Rosin Activated (RA) | ||
Chip Quik Inc. SMD3SWLT.047 8OZ | Bi58Sn42 (58/42) | 1.19 mm | 0.047 in | Wire Solder | 138 °C | 280 °F | Spool | 0.5 lb, 8 oz | 227 g | |||
Chip Quik Inc. SMD3SW.031 1OZ | Sn62Pb36Ag2 (62/36/2) | Wire Solder | 179 °C | 354 °F | Spool | 1 oz | 28.35 g | No-Clean, Water Soluble | Leaded | |||
Chip Quik Inc. SMD3SWLT.047 1OZ | Bi58Sn42 (58/42) | 1.19 mm | 0.047 in | Wire Solder | 138 °C | 280 °F | Spool | 1 oz | 28.35 g | |||
Chip Quik Inc. SMD3SWLT.047 2OZ | Bi58Sn42 (58/42) | 1.19 mm | 0.047 in | Wire Solder | 138 °C | 280 °F | Spool | 2 oz | 56.7 g | |||
Chip Quik Inc. SMD3SWLT.040 50G | Bi58Sn42 (58/42) | 1.02 mm | 0.04 in | Wire Solder | 138 °C | 280 °F | Spool | 1.8 oz | 50 g | No-Clean, Rosin Activated (RA) | ||
Chip Quik Inc. SMD3SWLT.040 20G | Bi58Sn42 (58/42) | 1.02 mm | 0.04 in | Wire Solder | 138 °C | 280 °F | Spool | 0.7 oz | 20 g | No-Clean, Rosin Activated (RA) | ||
Chip Quik Inc. SMD3SWLT.040 100G | Bi58Sn42 (58/42) | 1.02 mm | 0.04 in | Wire Solder | 138 °C | 280 °F | Spool | 3.53 oz | 100 g | No-Clean, Rosin Activated (RA) |