SOLDER WIRE 62/36/2 TIN/LEAD/SIL
| Part | Form | Form | Form | Type | Melting Point [custom] | Melting Point [custom] | Composition | Flux Type | Process | Diameter [diameter] | Diameter [diameter] | Form | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc.  | 1 oz  | 28.35 g  | Spool  | Wire Solder  | 354 °F  | 179 °C  | Sn62Pb36Ag2 (62/36/2)  | No-Clean  Water Soluble  | Leaded  | |||
Chip Quik Inc.  | 0.5 lb  8 oz  | 227 g  | Spool  | Wire Solder  | 280 °F  | 138 °C  | Bi58Sn42 (58/42)  | 1.19 mm  | 0.047 in  | |||
Chip Quik Inc.  | 0.7 oz  | 20 g  | Spool  | Wire Solder  | 280 °F  | 138 °C  | Bi58Sn42 (58/42)  | No-Clean  Rosin Activated (RA)  | 1.02 mm  | 0.04 in  | ||
Chip Quik Inc.  | 3.53 oz  | 100 g  | Spool  | Wire Solder  | 280 °F  | 138 °C  | Bi58Sn42 (58/42)  | No-Clean  Rosin Activated (RA)  | 1.02 mm  | 0.04 in  | ||
Chip Quik Inc.  | 4 oz  | 113.4 g  | Spool  | Wire Solder  | 280 °F  | 138 °C  | Bi58Sn42 (58/42)  | 1.19 mm  | 0.047 in  | |||
Chip Quik Inc.  | 2 oz  | 56.7 g  | Spool  | Wire Solder  | 280 °F  | 138 °C  | Bi58Sn42 (58/42)  | 1.19 mm  | 0.047 in  | |||
Chip Quik Inc.  | 1 oz  | 28.35 g  | Spool  | Wire Solder  | 280 °F  | 138 °C  | Bi58Sn42 (58/42)  | 1.19 mm  | 0.047 in  | |||
Chip Quik Inc.  | 0.35 oz  | Spool  | Wire Solder  | 280 °F  | 138 °C  | Bi58Sn42 (58/42)  | No-Clean  Rosin Activated (RA)  | 1.02 mm  | 0.04 in  | 10 g  | ||
Chip Quik Inc.  | 1.8 oz  | 50 g  | Spool  | Wire Solder  | 280 °F  | 138 °C  | Bi58Sn42 (58/42)  | No-Clean  Rosin Activated (RA)  | 1.02 mm  | 0.04 in  |