ESQT-109 Series
Manufacturer: Samtec Inc.
CONN ELEVATED SOCKET SKT 9 POS 2MM SOLDER ST TOP ENTRY THRU-HOLE LAYER
| Part | Number of Rows | Connector Type | Mounting Type | Contact Finish - Mating | Fastening Type | Number of Positions | Contact Finish - Post | Material Flammability Rating | Current Rating (Per Contact) | Contact Type | Operating Temperature (Max) | Operating Temperature (Min) | Number of Positions Loaded | Style | Termination | Contact Length - Post | Insulation Color | Pitch - Mating | Contact Finish Thickness - Mating | Insulation Height | Contact Shape | Contact Material | Insulation Material | Row Spacing - Mating | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 1 | Elevated Socket | Through Hole | Gold | Push-Pull | 9 | Tin | UL94 V-0 | 4.5 A | Forked | 125 °C | -55 °C | All | Board Board or Cable | Solder | 0.378 in | Black | 0.079 in | 10 µin | 0.472 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | ||
Samtec Inc. | 2 | Elevated Socket | Through Hole | Gold | Push-Pull | 18 | Tin | UL94 V-0 | 4.5 A | Forked | 125 °C | -55 °C | All | Board Board or Cable | Solder | 0.18 in | Black | 0.079 in | 3 µin | 0.67 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | 0.079 in | |
Samtec Inc. | 1 | Elevated Socket | Through Hole | Gold | Push-Pull | 9 | Tin | UL94 V-0 | 4.5 A | Forked | 125 °C | -55 °C | All | Board Board or Cable | Solder | 0.148 in | Black | 0.079 in | 30 µin | 0.31 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | ||
Samtec Inc. | 4 | Elevated Socket | Through Hole | Gold | Push-Pull | 36 | Gold | UL94 V-0 | 4.5 A | Forked | 125 °C | -55 °C | All | Board Board or Cable | Solder | 0.063 in | Black | 0.079 in | 20 Ąin | 0.395 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | 0.079 in | 3 µin |
Samtec Inc. | 2 | Elevated Socket | Through Hole | Gold | Push-Pull | 18 | Gold | UL94 V-0 | 4.5 A | Forked | 125 °C | -55 °C | All | Board Board or Cable | Solder | 0.095 in | Black | 0.079 in | 20 Ąin | 0.755 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | 0.079 in | 3 µin |
Samtec Inc. | 2 | Elevated Socket | Through Hole | Gold | Push-Pull | 18 | Gold | UL94 V-0 | 4.5 A | Forked | 125 °C | -55 °C | All | Board Board or Cable | Solder | 0.378 in | Black | 0.079 in | 20 Ąin | 0.472 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | 0.079 in | 3 µin |
Samtec Inc. | 2 | Elevated Socket | Through Hole | Gold | Push-Pull | 18 | Tin | UL94 V-0 | 4.5 A | Forked | 125 °C | -55 °C | All | Board Board or Cable | Solder | 0.108 in | Black | 0.079 in | 20 Ąin | 0.35 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | 0.079 in | |
Samtec Inc. | 2 | Elevated Socket | Through Hole | Gold | Push-Pull | 18 | Gold | UL94 V-0 | 4.5 A | Forked | 125 °C | -55 °C | All | Board Board or Cable | Solder | 0.108 in | Black | 0.079 in | 20 Ąin | 0.35 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | 0.079 in | 3 µin |
Samtec Inc. | 1 | Elevated Socket | Through Hole | Gold | Push-Pull | 9 | Gold | UL94 V-0 | 4.5 A | Forked | 125 °C | -55 °C | All | Board Board or Cable | Solder | 0.108 in | Black | 0.079 in | 20 Ąin | 0.35 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | 3 µin | |
Samtec Inc. | 1 | Elevated Socket | Through Hole | Gold | Push-Pull | 9 | Tin | UL94 V-0 | 4.5 A | Forked | 125 °C | -55 °C | All | Board Board or Cable | Solder | 0.103 in | Black | 0.079 in | 3 µin | 0.355 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) |