CAP FILM 4700PF 2% 50VDC 1206
| Part | Size / Dimension [y] | Size / Dimension [x] | Size / Dimension [x] | Size / Dimension [y] | Mounting Type | Capacitance | Operating Temperature [Min] | Operating Temperature [Max] | Package / Case | Voltage Rating - DC | Tolerance | Applications | Termination | Voltage Rating - AC | Dielectric Material | Height - Seated (Max) [Max] [z] | Height - Seated (Max) [Max] [z] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
KEMET | 1.7 mm | 3.3 mm | 0.13 in | 0.067 in | Surface Mount | 4700 pF | -55 °C | 125 °C | 1206 (3216 Metric) | 50 VDC | 2 % | General Purpose | Solder Pads | 40 V | Polyphenylene Sulfide (PPS) Metallized - Stacked | 0.043 in | 1.1 mm |
KEMET | 1.7 mm | 3.3 mm | 0.13 in | 0.067 in | Surface Mount | 6800 pF | -55 °C | 125 °C | 1206 (3216 Metric) | 50 VDC | 2 % | General Purpose | Solder Pads | Polyphenylene Sulfide (PPS) Metallized - Stacked | 0.043 in | 1.1 mm | |
KEMET | 1.7 mm | 3.3 mm | 0.13 in | 0.067 in | Surface Mount | 4700 pF | -55 °C | 125 °C | 1206 (3216 Metric) | 50 VDC | 5 % | General Purpose | Solder Pads | Polyphenylene Sulfide (PPS) Metallized - Stacked | 0.043 in | 1.1 mm | |
KEMET | 1.7 mm | 3.3 mm | 0.13 in | 0.067 in | Surface Mount | 0.012 µF | -55 °C | 125 °C | 1206 (3216 Metric) | 50 VDC | 5 % | General Purpose | Solder Pads | Polyphenylene Sulfide (PPS) Metallized - Stacked | 0.043 in | 1.1 mm |