24-3508 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Current Rating	Termination Post Length	Material Flammability Rating	Contact Finish - Mating	Features	Termination	Pitch - Post	Operating Temperature (Min)	Operating Temperature (Max)	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Contact Finish - Post	Pitch - Mating	Row Spacing	Type	Contact Material - Mating	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Mounting Type	Contact Finish Thickness - Mating
Aries Electronics 24-3508-201	3 A	0.36 in	UL94 V-0	Gold	Open Frame	Wire Wrap	0.1 in	-55 °C	105 °C	200 µin	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	Tin	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	Beryllium Copper	2	24	12	Through Hole	30 µin
Aries Electronics 24-3508-31	3 A	0.5 in	UL94 V-0	Gold	Open Frame	Wire Wrap	0.1 in	-55 °C	125 °C	10 µin	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	Gold	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	Beryllium Copper	2	24	12	Through Hole	30 µin
Aries Electronics 24-3508-211	3 A	0.5 in	UL94 V-0	Gold	Open Frame	Wire Wrap	0.1 in	-55 °C	125 °C	10 µin	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	Gold	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	Beryllium Copper	2	24	12	Through Hole	30 µin
Aries Electronics 24-3508-30	3 A	0.36 in	UL94 V-0	Gold	Open Frame	Wire Wrap	0.1 in	-55 °C	105 °C	200 µin	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	Tin	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	Beryllium Copper	2	24	12	Through Hole	30 µin
Aries Electronics 24-3508-20	3 A	0.36 in	UL94 V-0	Gold	Open Frame	Wire Wrap	0.1 in	-55 °C	105 °C	200 µin	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	Tin	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	Beryllium Copper	2	24	12	Through Hole	30 µin
Aries Electronics 24-3508-212	3 A	0.5 in	UL94 V-0	Gold	Open Frame	Wire Wrap	0.1 in	-55 °C	125 °C	10 µin	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	Gold	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	Beryllium Copper	2	24	12	Through Hole	30 µin
Aries Electronics 24-3508-312	3 A	0.5 in	UL94 V-0	Gold	Open Frame	Wire Wrap	0.1 in	-55 °C	125 °C	10 µin	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	Gold	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	Beryllium Copper	2	24	12	Through Hole	30 µin
Aries Electronics 24-3508-302	3 A	0.36 in	UL94 V-0	Gold	Open Frame	Wire Wrap	0.1 in	-55 °C	105 °C	200 µin	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	Tin	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	Beryllium Copper	2	24	12	Through Hole	30 µin
Aries Electronics 24-3508-21	3 A	0.5 in	UL94 V-0	Gold	Open Frame	Wire Wrap	0.1 in	-55 °C	125 °C	10 µin	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	Gold	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	Beryllium Copper	2	24	12	Through Hole	30 µin