CONN IC DIP SOCKET 24POS GOLD
| Part | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination Post Length [x] | Termination Post Length [x] | Operating Temperature [Max] | Operating Temperature [Min] | Features | Termination | Current Rating (Amps) | Housing Material | Contact Material - Post [custom] | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type | Type | Contact Finish - Mating | Contact Material - Mating | Number of Positions or Pins (Grid) | Mounting Type | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Termination Post Length | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 2.54 mm | 0.1 in | 200 µin | 5.08 µm | 0.36 in | 9.14 mm | 105 ░C | -55 °C | Open Frame | Wire Wrap | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | Brass | UL94 V-0 | 30 Áin | 0.76 Ám | 0.3 " | 7.62 mm | DIP | Gold | Beryllium Copper | 24 | Through Hole | Tin | 0.1 in | 2.54 mm | ||
Aries Electronics | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | 125 °C | -55 °C | Open Frame | Wire Wrap | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | Brass | UL94 V-0 | 30 Áin | 0.76 Ám | 0.3 " | 7.62 mm | DIP | Gold | Beryllium Copper | 24 | Through Hole | Gold | 0.1 in | 2.54 mm | 0.5 in | 12.7 mm | ||
Aries Electronics | 2.54 mm | 0.1 in | 200 µin | 5.08 µm | 0.36 in | 9.14 mm | 105 ░C | -55 °C | Open Frame | Wire Wrap | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | Brass | UL94 V-0 | 30 Áin | 0.76 Ám | 0.3 " | 7.62 mm | DIP | Gold | Beryllium Copper | 24 | Through Hole | Tin | 0.1 in | 2.54 mm | ||
Aries Electronics | 2.54 mm | 0.1 in | 200 µin | 5.08 µm | 0.36 in | 9.14 mm | 105 ░C | -55 °C | Open Frame | Wire Wrap | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | Brass | UL94 V-0 | 30 Áin | 0.76 Ám | 0.3 " | 7.62 mm | DIP | Gold | Beryllium Copper | 24 | Through Hole | Tin | 0.1 in | 2.54 mm | ||
Aries Electronics | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | 125 °C | -55 °C | Open Frame | Wire Wrap | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | Brass | UL94 V-0 | 30 Áin | 0.76 Ám | 0.3 " | 7.62 mm | DIP | Gold | Beryllium Copper | 24 | Through Hole | Gold | 0.1 in | 2.54 mm | 0.5 in | 12.7 mm | ||
Aries Electronics | 2.54 mm | 0.1 in | 200 µin | 5.08 µm | 0.36 in | 9.14 mm | 105 ░C | -55 °C | Open Frame | Wire Wrap | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | Brass | UL94 V-0 | 30 Áin | 0.76 Ám | 0.3 " | 7.62 mm | DIP | Gold | Beryllium Copper | 24 | Through Hole | Tin | 0.1 in | 2.54 mm | ||
Aries Electronics | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | 125 °C | -55 °C | Open Frame | Wire Wrap | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | Brass | UL94 V-0 | 30 Áin | 0.76 Ám | 0.3 " | 7.62 mm | DIP | Gold | Beryllium Copper | 24 | Through Hole | Gold | 0.1 in | 2.54 mm | 0.5 in | 12.7 mm |