FPC/FFC SMT CONN STENCIL
| Part | Thermal Center Pad [y] | Thermal Center Pad [x] | Thermal Center Pad [x] | Thermal Center Pad [y] | Material | Number of Positions | Outer Dimension [y] | Outer Dimension [x] | Outer Dimension [y] | Outer Dimension [x] | Thickness | Thickness | Pitch [x] | Pitch [x] | Type | Size / Dimension [y] | Size / Dimension [x] | Size / Dimension [y] | Size / Dimension [x] | Package Accepted | Board Thickness | Board Thickness | Board Thickness | Proto Board Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc. FPC050P050-S | 0.157 in | 1.291 in | 32.8 mm | 4 mm | Stainless Steel | 50 | 22.86 mm | 1.3 in | 0.9 " | 33.02 mm | 0.004 in | 0.102 mm | 0.5 mm | 0.02 in | FPC/FFC | |||||||||
Chip Quik Inc. FPC050P050 | FR4 Epoxy Glass | 50 | 0.5 mm | 0.02 in | 64.77 mm | 0.9 " | 2.55 " | 22.86 mm | FPC Connector | 0.062 in | 0.0625 in | 1.57 mm | SMD to DIP |