ESQT-133 Series

Catalog

CONN SOCKET 99POS 0.079 GOLD PCB

Part	Connector Type	Mounting Type	Contact Finish - Mating	Style	Number of Positions Loaded	Contact Type	Number of Rows	Contact Shape	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Fastening Type	Insulation Material	Insulation Color	Insulation Height	Insulation Height	Pitch - Mating [x]	Pitch - Mating [x]	Current Rating (Amps)	Number of Positions	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]	Contact Length - Post [x]	Contact Length - Post [x]	Contact Material	Row Spacing - Mating	Row Spacing - Mating	Material Flammability Rating	Insulation Height [custom]	Insulation Height [custom]	Contact Length - Post	Contact Length - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Samtec Inc. ESQT-133-02-F-T-725	Elevated Socket	Through Hole	Gold	Board to Board Cable	All	Forked	3	Square	3 µin	0.076 µm	Solder	Push-Pull	Liquid Crystal Polymer (LCP)	Black	0.725 "	18.42 mm	0.079 in	2 mm	4.5 A	99	Tin	-55 °C	125 °C	3.18 mm	0.125 in	Phosphor Bronze	0.079 in	2 mm	UL94 V-0
Samtec Inc. ESQT-133-03-F-D-350	Elevated Socket	Through Hole	Gold	Board to Board Cable	All	Forked	2	Square	3 µin	0.076 µm	Solder	Push-Pull	Liquid Crystal Polymer (LCP)	Black			0.079 in	2 mm	4.5 A	66	Tin	-55 °C	125 °C			Phosphor Bronze	0.079 in	2 mm	UL94 V-0	0.35 in	8.89 mm	0.108 in	2.75 mm
Samtec Inc. ESQT-133-03-M-Q-368	Elevated Socket	Through Hole	Gold	Board to Board Cable	All	Forked		Square	20 µin	0.51 µm	Solder	Push-Pull	Liquid Crystal Polymer (LCP)	Black	0.368 in	9.35 mm	0.079 in	2 mm	4.5 A	132	Tin	-55 °C	125 °C			Phosphor Bronze	0.079 in	2 mm	UL94 V-0			0.09 "	2.29 mm
Samtec Inc. ESQT-133-03-G-D-350	Elevated Socket	Through Hole	Gold	Board to Board Cable	All	Forked	2	Square	20 µin	0.51 µm	Solder	Push-Pull	Liquid Crystal Polymer (LCP)	Black			0.079 in	2 mm	4.5 A	66	Gold	-55 °C	125 °C			Phosphor Bronze	0.079 in	2 mm	UL94 V-0	0.35 in	8.89 mm	0.108 in	2.75 mm	3 µin	0.076 µm
Samtec Inc. ESQT-133-03-H-D-355	Elevated Socket	Through Hole	Gold	Board to Board Cable	All	Forked	2	Square	30 Áin	0.76 Ám	Solder	Push-Pull	Liquid Crystal Polymer (LCP)	Black	0.355 in	9.02 mm	0.079 in	2 mm	4.5 A	66	Gold	-55 °C	125 °C		0.103 in	Phosphor Bronze	0.079 in	2 mm	UL94 V-0				2.62 mm	3 µin	0.076 µm