CONN IC DIP SOCKET 8POS GOLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Pitch - Post | Pitch - Post | Features | Contact Finish - Mating | Current Rating (Amps) | Contact Material - Mating | Contact Finish Thickness - Post | Housing Material | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Post [custom] | Type | Type | Type | Termination | Termination Post Length | Termination Post Length | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Mating | Pitch - Mating | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
0.203 Ám | 8 Áin | UL94 V-0 | 2.54 mm | 0.1 in | Closed Frame, Seal Tape | Gold | 1 A | Beryllium Copper | Flash | Polyphenylene Sulfide (PPS), Glass Filled | Gold | 8 | Brass | 0.3 " | 7.62 mm | DIP | Solder | 3.2 mm | 0.126 in | 125 °C | -65 ░C | 0.1 in | 2.54 mm | Through Hole | |
0.203 Ám | 8 Áin | UL94 V-0 | 2.54 mm | 0.1 in | Open Frame | Gold | 1 A | Beryllium Copper | Flash | Polyphenylene Sulfide (PPS), Glass Filled | Gold | 8 | Brass | 0.3 " | 7.62 mm | DIP | Solder | 3.2 mm | 0.126 in | 125 °C | -65 ░C | 0.1 in | 2.54 mm | Through Hole |