Beta
⌘K
CONN SOCKET PGA ZIF GOLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Termination Post Length | Termination Post Length | Operating Temperature [Max] | Operating Temperature [Min] | Type | Current Rating (Amps) | Contact Material - Post | Pitch - Post | Pitch - Post | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type | Contact Material - Mating | Contact Finish - Post | Features | Termination | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 3.18 mm | 0.125 in | 125 °C | -65 ░C | PGA ZIF (ZIP) | 1 A | Beryllium Copper | 2.54 mm | 0.1 in | UL94 V-0 | 200 µin | 5.08 µm | Through Hole | Beryllium Copper | Tin | Closed Frame | Solder | Gold |