CONN HEADER SMD 19POS 1.27MM
| Part | Number of Positions | Insulation Material | Insulation Color | Current Rating (Amps) | Fastening Type | Number of Positions Loaded | Shrouding | Contact Length - Mating | Contact Length - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material | Number of Rows | Contact Finish - Mating | Mounting Type | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Material Flammability Rating | Contact Type | Termination | Insulation Height | Insulation Height | Contact Shape | Operating Temperature [Min] | Operating Temperature [Max] | Connector Type | Contact Length - Mating [x] | Features | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 19 | Liquid Crystal Polymer (LCP) | Black | 3.1 A | Push-Pull | All | Unshrouded | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | Phosphor Bronze | 1 | Gold | Surface Mount | 0.05 in | 1.27 mm | Tin | UL94 V-0 | Male Pin | Solder | 0.1 in | 2.54 mm | Square | -55 °C | 125 °C | Header | ||||||
Samtec Inc. | 19 | Liquid Crystal Polymer (LCP) | Black | 3.1 A | Push-Pull | All | Unshrouded | 5.84 mm | 30 Áin | 0.76 Ám | Phosphor Bronze | 1 | Gold | Surface Mount | 0.05 in | 1.27 mm | Tin | UL94 V-0 | Male Pin | Solder | 0.1 in | 2.54 mm | Square | -55 °C | 125 °C | Header | 0.23 in | ||||||
Samtec Inc. | 38 | Liquid Crystal Polymer (LCP) | Black | 3.1 A | Push-Pull | All | Unshrouded | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | Phosphor Bronze | 2 | Gold | Surface Mount | 0.05 in | 1.27 mm | Gold | UL94 V-0 | Male Pin | Solder | 0.1 in | 2.54 mm | Square | -55 °C | 125 °C | Header | Board Guide | 2.54 mm | 0.1 in | 3 µin | 0.076 µm | |
Samtec Inc. | 38 | Liquid Crystal Polymer (LCP) | Black | 3.1 A | Push-Pull | All | Unshrouded | 5.84 mm | 10 çin | 0.25 çm | Phosphor Bronze | 2 | Gold | Surface Mount | 0.05 in | 1.27 mm | Gold | UL94 V-0 | Male Pin | Solder | 0.1 in | 2.54 mm | Square | -55 °C | 125 °C | Header | 0.23 in | 2.54 mm | 0.1 in | 3 µin | 0.076 µm | ||
Samtec Inc. | 38 | Liquid Crystal Polymer (LCP) | Black | 3.1 A | Push-Pull | All | Unshrouded | 5.84 mm | 10 çin | 0.25 çm | Phosphor Bronze | 2 | Gold | Surface Mount | 0.05 in | 1.27 mm | Gold | UL94 V-0 | Male Pin | Solder | 0.1 in | 2.54 mm | Square | -55 °C | 125 °C | Header | 0.23 in | Board Guide | 2.54 mm | 0.1 in | 3 µin | 0.076 µm | |
Samtec Inc. | 38 | Liquid Crystal Polymer (LCP) | Black | 3.1 A | Push-Pull | All | Unshrouded | 0.125 in | 3.18 mm | 30 Áin | 0.76 Ám | Phosphor Bronze | 2 | Gold | Surface Mount | 0.05 in | 1.27 mm | Tin | UL94 V-0 | Male Pin | Solder | 0.1 in | 2.54 mm | Square | -55 °C | 125 °C | Header | 2.54 mm | 0.1 in | ||||
Samtec Inc. | 38 | Liquid Crystal Polymer (LCP) | Black | 3.1 A | Push-Pull | All | Unshrouded | 0.19 " | 4.83 mm | 10 çin | 0.25 çm | Phosphor Bronze | 2 | Gold | Surface Mount | 0.05 in | 1.27 mm | Gold | UL94 V-0 | Male Pin | Solder | 0.1 in | 2.54 mm | Square | -55 °C | 125 °C | Header | Board Guide | 2.54 mm | 0.1 in | 3 µin | 0.076 µm | |
Samtec Inc. | 19 | Liquid Crystal Polymer (LCP) | Black | 3.1 A | Push-Pull | All | Unshrouded | 5.84 mm | 30 Áin | 0.76 Ám | Phosphor Bronze | 1 | Gold | Surface Mount | 0.05 in | 1.27 mm | Tin | UL94 V-0 | Male Pin | Solder | 0.1 in | 2.54 mm | Square | -55 °C | 125 °C | Header | 0.23 in | Pick and Place |